LQH32CNR27M33L

SpecNo.JELF243A-0040S-01 P1/7
MURATA MFG.CO., LTD
Reference Only
CHIP COILCHIP INDUCTORSLQH32CN□□□□33L REFERENCE SPECIFICATION
1.Scope
This reference specification applies to LQH32CN_33 Series, Chip coil (Chip Inductors).
2.Part Numbering
(ex) LQ H 32 C N R15 M 3 3 L
Product ID
Structure
Dimension
Applications Category Inductance Tolerance Features
Electrode Packaging
(L×W)
and
L:Taping
Characteristics
3.Rating
Operating Temperature Range. -40 to +85°C
Storage Temperature Range. -40 to +85°C
Customer
Part Number
MURATA
Part Number
Inductance
DC
Resistance
()
Self
Resonant
Frequency
(MHz min)
Rated
Current
(mA)
(µH) Tolerance(%)
LQH32CNR15M33L 0.15
±20%
0.028 ± 30% 400 1450
LQH32CNR27M33L 0.27 0.034 ± 30% 250 1250
LQH32CNR47M33L 0.47 0.042 ± 30% 150 1100
LQH32CN1R0M33L 1.0 0.060 ± 30% 100 1000
LQH32CN2R2M33L 2.2 0.097 ± 30% 64 790
LQH32CN4R7M33L 4.7 0.15 ± 30% 43 650
LQH32CN100K33L 10 ±10% 0.30 ± 30% 26 450
When applied Rated current to the Products , self temperature rise shall be limited to 20 max and Inductance will be
within ±10% of initial Inductance value.
4. Testing Conditions
Unless otherwise specified In case of doubt
Temperature : Ordinary Temperature (15 to 35°C) Temperature
: 20 ± 2°C
Humidity
: Ordinary Humidity (25 to 85 %(RH)) Humidity : 60 to 70 %(RH)
Atmospheric Pressure : 86 to 106 kPa
5.Appearance and Dimensions
Unit Mass (Typical value)
0.060
(in mm)
2.5±0.2
2.5±0.2
2.5±0.2
2.0±0.2
3.2±0.3
0.9
±
0.3
*
Please refer to the dimention A for
2R2M,4R7M,100K types. (See Fig.1)
2.5±0.2
2.5±0.2
A
A:
2.8 max.
Fig.1
*
No marking.
1.3
±
0.2
0.9
±
0.3
SpecNo.JELF243A-0040S-01 P2/7
MURATA MFG.CO., LTD
Reference Only
6.Electrical Performance
No. Item Specification Test Method
6.1 Inductance Inductance shall meet item 3. Measuring Equipment:KEYSIGHT 4192A or equivalent
Measuring Frequency:1MHz
6.2 DC Resistance DC Resistance shall meet item 3. Measuring Equipment:Digital multi meter
6.3 Self Resonant
Frequency
(S.R.F)
S.R.F shall meet item 3. Measuring Equipment:
KEYSIGHT E4991A or equivalent
7.Mechanical Performance
No. Item Specification Test Method
7.1 Shear Test Chip coil shall not be damaged. Substrate: Glass-epoxy substrate
Applied Direction :
Force: 10N
Hold Duration: 5±1s
7.2 Bending Test Substrate: Glass-epoxy substrate
(100×40×1.6mm)
Speed of Applying Force: 1mm / s
Deflection: 2mm
Hold Duration: 30s
(in mm)
7.3 Vibration Oscillation Frequency: 10~55~10Hz for 1 minute
Total Amplitude: 1.5mm
Testing Time:
A period of 2 hours in each of 3 mutually
perpendicular directions.
(Total 6 hours)
7.4 Solderability The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux: Ethanol solution of rosin, 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90seconds
Solder Temperature: 240±5°C
Immersion Time: 3±1 s
7.5 Resistance to
Soldering Heat
Appearance:No damage
Inductance Change: within ± 5%
Flux: Ethanol solution of rosin, 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90seconds
Solder Temperature: 270±5°C
Immersion Time: 10±1 s
Then measured after exposure in the room condition for
24±2 hours.
Chip coil
Substrate
45
R340
F
Deflection
45
Product
Pressure jig
SpecNo.JELF243A-0040S-01 P3/7
MURATA MFG.CO., LTD
Reference Only
8.Environmental Performance (It shall be soldered on the substrate.)
No. Item Specification Test Method
8.1 Heat Resistance Appearance:No damage
Inductance Change: within ± 5%
DC Resistance Change:
within ± 5%
Temperature: 85±2°C
Time: 1000± hours
Then measured after exposure in the room condition for
24±2 hours.
8.2 Cold Resistance Temperature: -40±2°C
Time: 1000± hours
Then measured after exposure in the room condition for
24±2 hours.
8.3 Humidity Temperature: 40±2°C
Humidity: 90 to 95%(RH)
Time: 1000± hours
Then measured after exposure in the room condition for
24±2 hours.
8.4 Temperature
Cycle
1 cycle:
1 step: -40±2°C / 30±3 minutes
2 step: Ordinary temp. / 10 to 15 minutes
3 step: +85±2°C / 30±3 min
4 step: Ordinary temp. / 10 to 15 minutes
Total of 10 cycles
Then measured after exposure in the room condition for
24±2 hours.
9.
Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
(in mm)
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape 10N min.
Cover tape 5N min.
9.4 Peeling off force of cover tape
Speed of Peeling off 300mm/min
Peeling off force
0.2 to 0.7N
(minimum value is typical)
2.9±0.2
2.0±0.05
4.0±0.1
Direction of feed
2.1±0.1
Lead- in/out wire
4.0±0.1
3.6±0.2
8.0±0.2
1.75±0.13.5±0.05
φ
1.5
-0
+0.1
0.2
The packing directions of the chip coil
in taping are unified with the in/out
positions of the lead wire.
( )
165 to 180 degree
F
Cover tape
Plastic tape
Dimension of the Cavity is measured
at the bottom side.
48
00
48
00
48
00

LQH32CNR27M33L

Mfr. #:
Manufacturer:
Murata Electronics
Description:
Fixed Inductors 0.27uH 20%
Lifecycle:
New from this manufacturer.
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