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HMC220BMS8GETR

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18
HMC220B Data Sheet
Rev. A | Page 4 of 18
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
RF Input Power 25 dBm
LO Input Power
25 dBm
IF Input Power 25 dBm
IF Source and Sink Current 3 mA
Continuous Power Dissipation, P
DISS
211 mW
(T
A
= 85°C, Derate 10.81 mW/°C Above
85°C)
Maximum Junction Temperature
130°C
Maximum Peak Reflow Temperature (MSL1)
1
235°C
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +125°C
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM) 2000 V (Class 2)
Field Induced Charged Device Model
(FICDM)
750 V (Class C4)
1
See the Ordering Guide section.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Table 3. Thermal Resistance
Package Type
θ
JA
θ
JC
Unit
RH-8-3
1
104.7 300 °C/W
1
Thermal impedance simulated values are based on JEDEC 2S2P test board
with 3 x 3 thermal vias. See JEDEC JESD51-12 for additional information.
ESD CAUTION
Data Sheet HMC220B
Rev. A | Page 5 of 18
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
4
GND
GND
NIC
LO
8
7
6
5
GND
GND
IF
RF
HMC220B
(Not to Scale)
T
OP
VIEW
NOTES
1. NIC = NOT INTERNALLY CONNECTED. THIS PIN CAN
BE LEFT FLOATING OR IT CAN BE SOLDERED DOWN
TO RF/DC GND. THE NIC PIN DOES NOT AFFECT THE
PERFORMANCE OF THE HMC220B.
2. EXPOSED PAD. CONNECT THE EXPOSED PAD TO A
LOW IMPEDANCE THERMAL AND ELECTRICAL
GROUND PLANE.
15769-002
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic
Description
1
LO
Local Oscillator. This pin is ac-coupled and matched to 50 Ω. See Figure 4 for the LO interface schematic.
2, 3, 6, 7 GND Ground. Connect the package bottom to RF/dc ground. See Figure 3 for the GND interface schematic.
4 NIC
Not Internally Connected. This pin can be left floating or it can be soldered down to RF/dc GND. The NIC pin does
not affect the performance of the HMC220B.
5 IF Intermediate Frequency. This pin is dc-coupled. For applications not requiring operations to dc, dc block this port
externally using a series capacitor whose value is chosen to pass the necessary IF frequency range. For operation
to dc, this pin must not source or sink 3 mA of current, or the device is nonfunctioning and possible device failure
may result. See Figure 5 for the IF interface schematic.
8 RF Radio Frequency. This pin is ac-coupled internally and match to 50 Ω. See Figure 6 for the RF interface schematic.
EPAD Exposed Pad. Connect the exposed pad to a low impedance thermal and electrical ground plane.
INTERFACE SCHEMATICS
GND
15769-003
Figure 3. GND Interface Schematic
LO
15769-004
Figure 4. LO Interface Schematic
15769-005
IF
Figure 5. IF Interface Schematic
RF
15769-006
Figure 6. RF Interface Schematic
HMC220B Data Sheet
Rev. A | Page 6 of 18
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE
Downconverter Performance at IF = 100 MHz, Lower Sideband
Data taken at LO = 10 dBm, T
A
= 25°C, unless otherwise noted.
0
–5
–10
–15
–20
CONVERSION GAIN (dB)
513
RF FREQUENCY (GHz)
6 7 8 9 10 11 12
+85°C
+25°C
–40°C
15769-007
Figure 7. Conversion Gain vs. RF Frequency at Various Temperature
30
10
INPUT IP3 (dBm)
513
RF FREQUENCY (GHz)
6 7 8 9 10 11 12
+85°C
+25°C
–40°C
15
20
25
15769-008
Figure 8. Input IP3 vs. RF Frequency at Various Temperatures
100
20
INPUT IP2 (dBm)
30
40
50
60
70
80
90
513
RF FREQUENCY (GHz)
6 7 8 9 10 11 12
+85°C
+25°C
–40°C
15769-009
Figure 9. Input IP2 vs. RF Frequency at Various Temperatures
513
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
6789101112
15769-010
–20
–18
–16
–14
–12
–10
–8
–6
–4
–2
0
15dBm
13dBm
10dBm
9dBm
7dBm
Figure 10. Conversion Gain vs. RF Frequency at Various LO Powers
30
10
INPUT IP3 (dBm)
513
RF FREQUENCY (GHz)
6 7 8 9 10 11 12
15
20
25
9dBm
10dBm
13dBm
15769-011
Figure 11. Input IP3 vs. RF Frequency at Various LO Powers
100
20
513
INPUT IP2 (dBm)
RF FREQUENCY (GHz)
30
40
50
60
70
80
90
6 7 8 9 10 11 12
9dBm
10dBm
13dBm
15769-012
Figure 12. Input IP2 vs. RF Frequency at Various LO Powers
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18

HMC220BMS8GETR

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Manufacturer:
Analog Devices / Hittite
Description:
RF Mixer 5-12 GHz DBL-BAL Mixer
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