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002-01 / 20070815 / ef12_ffe.fm
• All specifications are subject to change without notice.
ELECTRICAL CHARACTERISTICS
∗
Group delay time: 0.50max.
RELIABILITY AND TEST CONDITIONS
The following test items are satisfied.
(1) Center frequency: Within ±30kHz
(2) 3dB band width: Within ±20kHz
(3) 20dB band width: Within ±30kHz
(4) Insertion loss: Within ±2dB
(5) Attenuation: 25dB min.
SOLDERABILITY
The lead wires are adopted Pb free plating wire to apply Pb free
soldering. You can also use current Sn-Pb eutectic solder.
RECOMMENDED SOLDERING CONDITIONS
This is the fit product for flow soldering.
FLOW SOLDERING CONDITION
Part No.
3dB band width
(kHz)
20dB band width
(kHz)max.
Insertion loss
(dB)max.
SPR attenuation
(dB)min.
Standard type
FFE1070MA11UXL 280±50 600 6.0 35
FFE1070NA11UXL 230±50 570 6.0 35
FFE1070MS11SBL 180±40 520 7.0 35
FFE1070MJ11FBL 150±40 400 10.0 35
Low loss type
FFE1070MA11UAL 280±50 600 5.0 35
FFE1070NA11UAL 230±50 570 4.5 35
FFE1070MS11SAL 180±40 520 5.0 35
FFE1070MJ11FAL 150±40 400 7.0 35
Group delay time control type
FFE1070NA10UGL
∗
230±50 570 6.0 35
FFE1070MS10SGL
∗
180±40 520 7.0 35
Test items Test conditions
Low temperature
storage characteristics
Temperature: –40±3°C
Time: 100h
High temperature
storage characteristics
Temperature: +85±2°C
Time: 100h
Humidity resistance
Loading: DC.5V(between in/out and
ground terminal)
Humidity: 90 to 95(%)RH
Temperature: 60±2°C
Time: 100h
Thermal shock –40°C (30min), 85°C (30min) x 5 cycles
Soldering heat resistance Solder temperature: peak 260°C, 10s flow
Drop
Drop 3 times onto a hard wooden board
from a height of 1m
Vibration
Frequency: 10 ⇔ 55 ⇔ 10Hz/Ampli-
tude: 1.5mm
X, Y and Z directions for 2h each
Test conditions Test result
With Rosin-methanol 25% by weight, dip in Sn-Pb
eutectic solder bath at 230±5°C for 3±0.5sec. or
Pb free solder(Sn-3Ag-0.5Cu) bath at 245±2°C
for 3±0.2sec.
95% minimum of
surface should be
covered by new solder.
Heat-resistant temperature 260±5°C
Heat-resistant time 10±1sec.
Number of times 1time