STT3PF30L

1/8September 2002
.
STT3PF30L
P-CHANNEL 30V - 0.14 - 3A SOT23-6L
STripFET™ II POWER MOSFET
TYPICAL R
DS
(on) = 0.14
STANDARD OUTLINE FOR EASY
AUTOMATED SURFACE MOUNT ASSEMBLY
LOW THRESHOLD DRIVE
DESCRIPTION
This Power MOSFET is the latest development of
STMicroelectronis unique "Single Feature Size™"
strip-based process. The resulting transistor
shows extremely high packing density for low on-
resistance, rugged avalanche characteristics and
less critical alignment steps therefore a remark-
able manufacturing reproducibility.
APPLICATIONS
DC MOTOR DRIVE
DC-DC CONVERTERS
BATTERY MANAGEMENT IN NOMADIC
EQUIPMENT
POWER MANAGEMENT IN
PORTABLE/DESKTOP PCs
CELLULAR
MARKING
STA3
TYPE
V
DSS
R
DS(on)
I
D
STT3PF30L 30 V <0.165
3 A
SOT23-6L
ABSOLUTE MAXIMUM RATINGS
(
•)
Pulse width limited by safe operating area. Note: P-CHANNEL MOSFET actual polarity of voltages and current
has to be reversed
Symbol Parameter Value Unit
V
DS
Drain-source Voltage (V
GS
= 0)
30 V
V
DGR
Drain-gate Voltage (R
GS
= 20 k
)
30 V
V
GS
Gate- source Voltage ± 16 V
I
D
Drain Current (continuous) at T
C
= 25°C
2.4 A
I
D
Drain Current (continuous) at T
C
= 100°C
1.5 A
I
DM
(
•)
Drain Current (pulsed) 10 A
P
tot
Total Dissipation at T
C
= 25°C
1.6 W
INTERNAL SCHEMATIC DIAGRAM
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STT3PF30L
2/8
THERMAL DATA
(*) Mounted on a 1 inch pad of 2 oz. Cu in FR-4 board
(**) Mounted on a minimum pad of 2 oz. Cu in FR-4 board
ELECTRICAL CHARACTERISTICS (T
case
= 25 °C unless otherwise specified)
OFF
ON
(*)
DYNAMIC
Rthj-amb
Rthj-amb
T
j
T
stg
(*)Thermal Resistance Junction-ambient
(**)Thermal Resistance Junction-ambient
Max. Operating Junction Temperature
Storage Temperature
Max
Max
78
156
-55 to 150
-55 to 150
°C/W
°C/W
°C
°C
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
Breakdown Voltage
I
D
= 250 µA, V
GS
= 0
30
V
I
DSS
Zero Gate Voltage
Drain Current (V
GS
= 0)
V
DS
= Max Rating
V
DS
= Max Rating T
C
= 125°C
1
10
µA
µA
I
GSS
Gate-body Leakage
Current (V
DS
= 0)
V
GS
= ± 16 V
±100 nA
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
I
D
= 250 µA
1 1.6 2.5 V
R
DS(on)
Static Drain-source On
Resistance
V
GS
= 10 V I
D
= 1.5 A
V
GS
= 4.5 V I
D
= 1.5 A
0.14
0.16
0.165
0.2
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
fs
(*)
Forward Transconductance
V
DS
=25 V I
D
= 1.5 A
4S
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V
DS
= 25V f = 1 MHz, V
GS
= 0
420
95
30
pF
pF
pF
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3/8
STT3PF30L
SWITCHING ON
SWITCHING OFF
SOURCE DRAIN DIODE
(*)
Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
(
•)Pulse width limited by safe operating area.
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
t
r
Turn-on Delay Time
Rise Time
V
DD
= 15 V I
D
= 1.5 A
R
G
= 4.7
V
GS
= 4.5 V
(Resistive Load, Figure 1)
14.5
37
ns
ns
Q
g
Q
gs
Q
gd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V
DD
= 24V I
D
= 3A V
GS
=4.5V
(see test circuit, Figure 2)
4.8
1.7
2
7nC
nC
nC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
t
f
Turn-off Delay Time
Fall Time
V
DD
= 15 V I
D
= 1.5 A
R
G
= 4.7
Ω,
V
GS
= 4.5 V
(Resistive Load, Figure 1)
90
23
ns
ns
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
(
)
Source-drain Current
Source-drain Current (pulsed)
3
12
A
A
V
SD
(*)
Forward On Voltage
I
SD
= 3 A V
GS
= 0
1.2 V
t
rr
Q
rr
I
RRM
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
I
SD
= 3 A di/dt = 100A/µs
V
DD
= 15 V T
j
= 150°C
(see test circuit, Figure 3)
35
25
1.5
ns
nC
A
ELECTRICAL CHARACTERISTICS (continued)
Safe Operating Area Thermal Impedance

STT3PF30L

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
MOSFET P-CH 30V 2.4A SOT23-6
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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