AORN
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Vishay Dale Thin Film
Revision: 24-Feb-15
2
Document Number: 60127
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
• Gold thickness less than 10 μ".
STANDARD ELECTRICAL SPECIFICATIONS
TEST SPECIFICATIONS CONDITIONS
Material Tantalum nitride (Ta2N) -
Pin/Lead Number 8-
Resistance Range 1 k to 100 k per resistor -
TCR: Absolute ± 25 ppm/°C (standard) -55 °C to +155 °C
TCR: Tracking ± 5 ppm/°C (typical) -55 °C to +155 °C
Tolerance: Absolute ± 0.10 % to ± 1 % At +25 °C temperature
Tolerance: Ratio ± 0.05 % to ± 0.1 % At +25 °C temperature
Power Rating: Resistor 100 mW Maximum at +70 °C
Power Rating: Package 400 mW Maximum at +70 °C
Stability: Absolute R ± 0.05 % 1000 h at +155 °C
Stability: Ratio R ± 0.015 % 1000 h at +155 °C
Voltage Coefficient < 0.1 ppm/V -
Working Voltage 100 V max. not to exceed -
Operating Temperature Range -55 °C to +155 °C -
Storage Temperature Range -55 °C to +155 °C -
Noise -30 dB -
Thermal EMF 0.08 μV/°C -
Shelf Life Stability: Absolute R ± 0.01 % 1 year at +25 °C
Shelf Life Stability: Ratio R ± 0.002 % 1 year at +25 °C
DIMENSIONS AND IMPRINTING in inches and millimeters
DIMENSION INCHES MILLIMETERS
A 0.157 3.99
B 0.0165 ± 0.0025 0.4 ± 0.06
C 0.050 1.27
D 0.195 max. 4.93 max.
E 0.008 ± 0.001 0.20 ± 0.03
F 0.028 ± 0.001 0.71 ± 0.02
G 0.239 ± 0.001 6.07 ± 0.13
H 0.068 max. 1.73 max.
I 0.008 ± 0.002 6.07 ± 0.13
Seating
Plane
A
B
C
E
H
G
F
AORN
Date
Code
I
D
MECHANICAL SPECIFICATIONS
Resistive Element Tantalum nitride (Ta2N)
Substrate Material Ceramic
Body Molded epoxy
Terminals Copper alloy
Lead Frame Finish Ni/Pd/Au solder free
(1)
DERATING CURVE
Ambient Temperature °C
070125155
0
20
40
60
80
100
Precent of Rated Power
100 % = 0.40 W