SpecNo.JELF243A-0116-01 P8/10
MURATA MFG.CO., LTD
Reference
Only
11.5 Solder Volume
Solder shall be used not to be exceed・ ed the upper limits as shown below.
・・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
1/3T≦ t ≦T
(T: Lower flange thickness)
11.6 Product's location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
[Products direction]
Products shall be locatedin the sideways
direction (Length:a
・b) to the mechanical
stress.
(2) Products location on P.C.B. separation
Products (A,B,C,D) shall be located carefully so
that products are not subject to the mechanical
stress due to warping the board.
Because they may be subjected the mechanical
stress in order of A
・C・B D.
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W /l max. Frequency : 28kHz to 40kHz Time : 5 minutes max.
(3) Cleaner
1. Alternative cleaner
・Isopropyl alcohol (IPA)
2. Aqueous agent
・PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in
order to remove the cleaner.
(5) Other cleaning
Please contact us.
11.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An
open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or
operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by
hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So,
please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products
mounted on your board.
Upper Limit
Recommendable
T
t
〈
Poor example
〉
〈
Good example
〉
b
a
Seam
Slit
A
D
B
C
b
a
Length:a
b