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HMC553ALC3BTR-R5

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P25
HMC553ALC3B Data Sheet
Rev. A | Page 4 of 25
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
RF Input Power 25 dBm
LO Input Power
25 dBm
IF Input Power 25 dBm
IF Source/Sink Current 3 mA
Reflow Temperature 260°C
Maximum Junction Temperature 175°C
Continuous Power Dissipation, P
DISS
(T
A
= 85°C, Derate 4.6 mW/°C Above 85°C)
414 mW
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Lead Temperature Range −65°C to +150°C
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM) 1000 V
Field Induced Charged Device Model
(FICDM)
1250 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to PCB design and
operating environment. Careful attention to PCB thermal
design is required.
θ
JA
is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θ
JC
is
the junction to case thermal resistance.
Table 3. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
E-12-4
1
120 175 °C/W
1
See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
ESD CAUTION
Data Sheet HMC553ALC3B
Rev. A | Page 5 of 25
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
GND
7
GND
8
RF
9
GND
10
NIC
11
NIC
12
NIC
4
GND
2
LO
3
GND
5
IF
6
GND
PACKAGE
BASE
GND
NOTES
1. NOT INTERNALLY CONNECTED. THESE PINS
CAN BE CONNECTED TO RF/DC GROUND.
PERFORMANCE IS NOT AFFECTED.
2. EXPOSED PAD. THE EXPOSED PAD MUST BE
CONNECTED TO RF/DC GROUND.
HMC553ALC3B
TOP VIEW
(Not to Scale)
16420-002
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 3, 4, 6, 7, 9 GND Ground. These pins and package bottom must be connected to RF/dc ground.
2 LO Local Oscillator Port. This pin is ac-coupled and matched to 50 Ω.
5 IF
Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to dc, dc block
this port externally using a series capacitor of a value chosen to pass the necessary IF frequency range. For
operation to dc, this pin must not source or sink more than 3 mA of current or die malfunction and possible
die failure may result.
8 RF Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω.
10, 11, 12 NIC Not Internally Connected. These pins can be connected to RF/dc ground. Performance is not affected.
EPAD Exposed Pad. The exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS
GND
16420-003
Figure 3. GND Interface Schematic
LO
16420-004
Figure 4. LO Interface Schematic
16420-005
Figure 5. IF Interface Schematic
RF
16420-006
Figure 6. RF Interface Schematic
HMC553ALC3B Data Sheet
Rev. A | Page 6 of 25
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE
IF = 100 MHz, Upper Sideband (Low-Side LO)
–20
–15
–10
–5
0
5 6
7
8
9
10
11
12 13
14
15
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-007
Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
10
20
30
15
25
5 6
7
8 9
10 11
12 13 14
15
INPUT IP3 (dBm)
RF FREQUENCY (GHz)
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
16420-008
Figure 8. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
–20
–15
–10
–5
0
5
6 7 8 9
10
11
12
13 14
15
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-010
Figure 9. Conversion Gain vs. RF Frequency at Various LO Power Levels,
T
A
= 25°C
0
5
10
20
30
15
25
5 6 7 8 9 10 11 12 13 14 15
INPUT IP3 (dBm)
RF FREQUENCY (GHz)
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
16420-011
Figure 10. Input IP3 vs. RF Frequency at Various LO Power Levels,
T
A
= 25°C
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P25

HMC553ALC3BTR-R5

Mfr. #:
Buy HMC553ALC3BTR-R5
Manufacturer:
Analog Devices Inc.
Description:
RF Mixer WidebandPassiveMixer
Lifecycle:
New from this manufacturer.
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