TCP−3056N
www.onsemi.com
4
ASSEMBLY CONSIDERATIONS AND REFLOW PROFILE
The following assembly considerations should be observed:
Cleanliness
These chips should be handled in a clean environment.
Electro-static Sensitivity
ON Semiconductor’s PTICs are ESD Class 1A sensitive.
The proper ESD handling procedures should be used.
Mounting
The WLCSP PTIC is fabricated for Flip Chip solder
mounting. Connectivity to the RF and Bias terminations on
the PTIC die is established through copper pillar posts
(53 mm nominal height) topped with lead-free SAC351
solder caps (28 mm nominal height). The PTIC die is
RoHS-compliant and compatible with lead-free soldering
profile.
Post-reflow Cleaning
Use of ultrasonic cleaning is not recommended for
pillared devices as it may lead to premature fatigue failure
of the pillars.
Molding
The PTIC die is compatible for over-molding or
under-fill.
Figure 5. Reflow Profile
ORIENTATION OF THE PTIC FOR OPTIMUM LOSSES
When configuring the PTIC in your specific circuit
design, at least one of the RF terminals must be connected
to DC ground. If minimum transition times are required, DC
ground on both RF terminals is recommended. To minimize
losses, the PTIC should be oriented such that RF2 is at the
lower RF impedance of the two RF nodes. A shunt PTIC, for
example, should have RF2 connected to RF ground.
Figure 6. PTIC Orientation Functional Block
Diagram
Bias
RF ANT
RF1
(PTIC Pad)
RF2
(PTIC Pad)
