54
BFH18 Series Construction (Recommended Specifications)
1. Single-Sided FPC
2. Using Double-Sided FPC
3. Precautions
1. This specification is a recommendation for the construction of the FH18 Series FPC (t=0.2 ±0.03).
2. For details about the construction, please contact the FPC/FFC manufacturers.
Note: Stiffener is not required for the double-sided FPC.
To prevent release of the lock due to FPC bending, please do not use copper foil on the rear side.
Material Name
Covering layer film
Cover adhesive
Surface treatment
Copper foil
Base adhesive
Base film
Reinforcement material adhesive
Stiffener
Polyamide 1 mil
Solder plating
Cu 1oz
Polyamide 1 mil
Polyamide 3 mil
Total
25
25
5
35
25
25
30
75
195
Material
Thickness (µm)
Material Name
Covering layer film
Cover adhesive
Surface treatment
Through hole copper
Copper foil
Base adhesive
Base film
Base adhesive
Copper foil
Cover adhesive
Cover layer film
Reinforcement material adhesive
Stiffener
Polyamide 1 mil
Solder plating
Cu
Cu 1/2oz
Polyamide 1 mil
Cu 1/2oz
Polyamide 1 mil
Polyamide 1 mil
Total
25
25
5
15
18
18
25
18
18
25
25
25
25
199
Material
Thickness (µm)
FPC/FFC Manufactures' Contact List
Sumitomo Bakelite Co., Ltd. Flexible Printed Circuit Board Division TEL:+81 3 5462 4191
5-8, Higashi-shinagawa 2-chome, Shinagawa-ku, Tokyo, Japan
FAX:+81 3 5462 4882
Fujikura Ltd. Electronics Global Marketing Department TEL:+81 3 5606 1165
1-5-1, Kiba, Koto-ku, Tokyo, Japan FAX:+81 3 5606 1530
NOK Corporation Sales Division Overseas Business Department TEL:+81 3 3432 6976/8415
1-12-15, Shiba-Daimon, Minato-ku, Tokyo, Japan FAX:+81 3 3432 3919
