Package Dimensions
Figure 4: 96-Ball FBGA – Die Revision A (Package Code DGA)
Seating plane
0.1 A
Ball A1 ID
(covered by SR)
Ball A1 ID
A
0.29 MIN
1.1 ±0.1
6.4 CTR
9.5 ±0.1
0.8 TYP
12 CTR
14 ±0.1
96X Ø0.47
Dimensions apply
to solder balls post-
reflow on Ø0.42 SMD
ball pads.
0.8 TYP
123789
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
Notes:
1. All dimensions are in millimeters.
2. Solder ball material: SAC302 (96.8% Sn, 3% Ag, 0.2% Cu).
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This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization some-
times occur.
16Gb: x16 TwinDie DDR3L SDRAM
Package Dimensions
PDF: 09005aef85d16d13
DDR3L_16Gb_x16_2CS_TwinDie.pdf - Rev. B 03/15 EN
12
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