AOT9N50

AOT9N50/AOTF9N50
500V, 9A N-Channel MOSFET
General Description Product Summary
V
DS
I
D
(at V
GS
=10V) 9A
R
DS(ON)
(at V
GS
=10V) < 0.85
100% UIS Tested
100% R
g
Tested
For Halogen Free add "L" suffix to part number:
AOT9N50L & AOTF9N50L
Symbol
V
DS
V
GS
I
DM
I
AR
E
AR
E
AS
Peak diode recovery dv/dt dv/dt
T
J
, T
STG
T
L
Symbol
R
θ
JA
R
θCS
R
θJC
* Drain current limited by maximum junction temperature.
0.65
--
Units
°C/W65
0.5
65
3.25
Junction and Storage Temperature Range
Maximum Junction-to-Ambient
A,D
Power Dissipation
B
P
D
T
C
=25°C
Thermal Characteristics
300
-55 to 150
1.5 0.3
Avalanche Current
C
154
Single plused avalanche energy
G
307
3.2
Repetitive avalanche energy
C
V±30Gate-Source Voltage
T
C
=100°C
A
30Pulsed Drain Current
C
Continuous Drain
Current
T
C
=25°C
9
The AOT9N50 & AOTF9N50 have been fabricated using
an advanced high voltage MOSFET process that is
designed to deliver high levels of performance and
robustness in popular AC-DC applications.
By providing low R
DS(on)
, C
iss
and C
rss
along with
guaranteed avalanche capability these parts can be
adopted quickly into new and existing offline power supply
designs.
V
UnitsParameter
Absolute Maximum Ratings T
A
=25°C unless otherwise noted
AOT9N50 AOTF9N50
600V@150
Drain-Source Voltage 500
I
D
5
38.5192
6.0
9*
6*
Maximum Case-to-sink
A
Maximum Junction-to-Case
mJ
°C/W
°C/W
Derate above 25
o
C
Parameter AOT9N50 AOTF9N50
purpose, 1/8" from case for 5 seconds
A
W
W/
o
C
°C
mJ
V/ns
°C
Top View
TO-220F
TO-220
G
D
S
G
D
S
G
D
S
Rev3: July 2010 www.aosmd.com Page 1 of 6
AOT9N50/AOTF9N50
Symbol Min Typ Max Units
500
600
BV
DSS
/
TJ
0.56
V/
o
C
1
10
I
GSS
Gate-Body leakage current
±100
nΑ
V
GS(th)
Gate Threshold Voltage
3.4 4 4.5 V
R
DS(ON)
0.66 0.85
g
FS
10 S
V
SD
0.74 1 V
I
S
Maximum Body-Diode Continuous Current 9 A
I
SM
30 A
C
iss
694 868 1042 pF
C
oss
74 93 112 pF
C
rss
6.2 7.8 9.4 pF
R
g
2 4 6
Q
g
15 23.6 28 nC
Q
gs
4 5.2 6.2 nC
Q
gd
8.5 10.6 12.7 nC
t
D(on)
19.5 ns
t
r
47 ns
t
D(off)
51.5 ns
t
f
38.5 ns
t
rr
195 248 300
ns
Q
rr
2.5 3.5 4.5
µC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
µA
V
DS
=0V, V
GS
30V
V
Drain-Source Breakdown Voltage
I
D
=250µA, V
GS
=0V, T
J
=25°C
I
D
=250µA, V
GS
=0V, T
J
=150°C
BV
DSS
Body Diode Reverse Recovery Charge
I
F
=9A,dI/dt=100A/µs,V
DS
=100V
Maximum Body-Diode Pulsed Current
Input Capacitance
Output Capacitance
Turn-On DelayTime
DYNAMIC PARAMETERS
Turn-On Rise Time
Diode Forward Voltage
Turn-Off DelayTime
V
GS
=10V, V
DS
=250V, I
D
=9A,
R
G
=25
Gate resistance
V
GS
=0V, V
DS
=0V, f=1MHz
Turn-Off Fall Time
Total Gate Charge
V
GS
=10V, V
DS
=400V, I
D
=9A
Gate Source Charge
Gate Drain Charge
V
DS
=5V
I
D
=250µA
V
DS
=400V, T
J
=125°C
Zero Gate Voltage Drain Current
I
DSS
Zero Gate Voltage Drain Current
V
DS
=500V, V
GS
=0V
ID=250µA, VGS=0V
Electrical Characteristics (T
J
=25°C unless otherwise noted)
STATIC PARAMETERS
Parameter Conditions
Body Diode Reverse Recovery Time
Static Drain-Source On-Resistance
V
GS
=10V, I
D
=4.5A
Reverse Transfer Capacitance
I
F
=9A,dI/dt=100A/µs,V
DS
=100V
V
GS
=0V, V
DS
=25V, f=1MHz
SWITCHING PARAMETERS
I
S
=1A,V
GS
=0V
V
DS
=40V, I
D
=4.5A
Forward Transconductance
A. The value of R
θJA
is measured with the device in a still air environment with T
A
=25°C.
B. The power dissipation P
D
is based on T
J(MAX)
=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature T
J(MAX)
=150°C, Ratings are based on low frequency and duty cycles to keep initial T
J
=25°C.
D. The R
θJA
is the sum of the thermal impedence from junction to case R
θJC
and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of T
J(MAX)
=150°C. The SOA curve provides a single pulse ratin g.
G. L=60mH, I
AS
=3.2A, V
DD
=150V, R
G
=25, Starting T
J
=25°C
Rev3: July 2010 www.aosmd.com Page 2 of 6
AOT9N50/AOTF9N50
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
40
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0 0.2 0.4 0.6 0.8 1.0
V
SD
(Volts)
Figure 6: Body-Diode Characteristics (Note E)
I
S
(A)
25°C
125°C
0
3
6
9
12
15
18
0 5 10 15 20 25 30
V
DS
(Volts)
Fig 1: On-Region Characteristics
I
D
(A)
V
GS
=5.5V
6V
10V
6.5V
0.1
1
10
100
2 4 6 8 10
V
GS
(Volts)
Figure 2: Transfer Characteristics
I
D
(A)
-55°C
V
DS
=40V
25°C
125°C
0.0
0.5
1.0
1.5
2.0
0 4 8 12 16 20
I
D
(A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage
R
DS(ON)
(
)
V
GS
=10V
0
0.5
1
1.5
2
2.5
3
-100 -50 0 50 100 150 200
Temperature C)
Figure 4: On-Resistance vs. Junction Temperature
Normalized On-Resistance
V
GS
=10V
I
D
=4.5A
0.8
0.9
1
1.1
1.2
-100 -50 0 50 100 150 200
T
J
C)
Figure 5:Break Down vs. Junction Temparature
BV
DSS
(Normalized)
Rev3: July 2010 www.aosmd.com Page 3 of 6

AOT9N50

Mfr. #:
Manufacturer:
Description:
MOSFET N-CH 500V 9A TO-220
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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