MT72KSS4G72PZ-1G4N1 Datasheet MT72KSS4G72PZ-1G4N1 | P13-P15

3. T

and T

are simultaneous requirements.

4. For further information, refer to technical note TN-00-08: Thermal Applications, availa-

ble on micron.com.

5. The refresh rate is required to double when 85°C < T

≤ 95°C.

6. Inputs are terminated to V

/2. Input current is dependent on terminating resistance se-

lected in register.

32GB (x72, ECC, QR) 240-Pin DDR3L RDIMM

Electrical Specifications

CCMTD-1592877392-10326

kss72c4gx72pz.pdf - Rev. A 10/16 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

DRAM Operating Conditions

Recommended AC operating conditions are given in the DDR3 component data sheets.

Component specifications are available at micron.com. Module speed grades correlate

with component speed grades, as shown below.

Table 9: Module and Component Speed Grades

DDR3 components may exceed the listed module speed grades; module may not be available in all listed speed grades

Module Speed Grade Component Speed Grade

-2G1 -093

-1G9 -107

-1G6 -125

-1G4 -15E

-1G1 -187E

-1G0 -187

-80C -25E

-80B -25

Design Considerations

Simulations

Micron memory modules are designed to optimize signal integrity through carefully de-

signed terminations, controlled board impedances, routing topologies, trace length

matching, and decoupling. However, good signal integrity starts at the system level.

Micron encourages designers to simulate the signal characteristics of the system's

memory bus to ensure adequate signal integrity of the entire memory system.

Power

Operating voltages are specified at the DRAM, not at the edge connector of the module.

Designers must account for any system voltage drops at anticipated power levels to en-

sure the required supply voltage is maintained.

32GB (x72, ECC, QR) 240-Pin DDR3L RDIMM

DRAM Operating Conditions

CCMTD-1592877392-10326

kss72c4gx72pz.pdf - Rev. A 10/16 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Specifications

Table 10: DDR3 I

CDD

Specifications and Conditions – 32GB (Die Revision N)

Values are for the MT41K2G4 DDR3L SDRAM only and are computed from values specified in the 8Gb 1.35V TwinDie (2 Gig

x 4) component data sheet

Parameter

Combined

Symbol 1333 Units

Operating current 0: One bank ACTIVATE-to-PRECHARGE I

CDD0

1584 mA

Operating current 1: One bank ACTIVATE-to-READ-to-PRECHARGE I

CDD1

1728 mA

Precharge power-down current: Slow exit I

CDD2P0

576 mA

Precharge power-down current: Fast exit I

CDD2P1

648 mA

Precharge quiet standby current I

CDD2Q

1080 mA

Precharge standby current I

CDD2N

1080 mA

Precharge standby ODT current I

CDD2NT

1224 mA

Active power-down current I

CDD3P

864 mA

Active standby current I

CDD3N

1296 mA

Burst read operating current I

CDD4R

2124 mA

Burst write operating current I

CDD4W

2124 mA

Refresh current I

CDD5B

3744 mA

Self refresh temperature current: MAX T

= 85°C I

CDD6

864 mA

Self refresh temperature current (SRT-enabled): MAX T

= 95°C I

CDD6ET

1152 mA

All banks interleaved read current I

CDD7

2934 mA

Reset current I

CDD8

720 mA

32GB (x72, ECC, QR) 240-Pin DDR3L RDIMM

Specifications

CCMTD-1592877392-10326

kss72c4gx72pz.pdf - Rev. A 10/16 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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MT72KSS4G72PZ-1G4N1

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Description:

MODULE DDR3 32GB RDIMM

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