LQH2MCN120M52L

SpecNo.JELF243A-0060K-01 P1/7
MURATA MFG.CO., LTD
Reference Only
CHIP COIL(CHIP INDUCTORS) LQH2MCN□□□□52L REFERENCE SPECIFICATION
1.Scope
This reference specification applies to LQH2MCN_52 Series, Chip coil (Chip Inductors).
2.Part Numbering
(ex) LQ H 2M C N 4R7 M 5 2 L
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W) and L: Taping
Characteristics
3.Rating
Operating Temperature Range. -40 to +85°C
Storage Temperature Range. -40 to +85°C
Customer
Part Number
MURATA
Part Number
Inductance
DC
Resistance
(Ω)
Self
Resonant
Frequency
(MHz min)
Rated
Current
(mA)
(µH) Tolerance
LQH2MCN1R0M52L 1.0
M:±20%
0.25 ±30% 215 595
LQH2MCN1R5M52L 1.5 0.33 ±30% 165 540
LQH2MCN2R2M52L 2.2 0.42 ±30% 125 500
LQH2MCN3R3M52L 3.3 0.74 ±30% 110 360
LQH2MCN4R7M52L 4.7 0.91 ±30% 90 335
LQH2MCN6R8M52L 6.8 1.23 ±30% 65 285
LQH2MCN100M52L 10 2.27 ±30% 60 200
LQH2MCN120M52L 12 2.4 ±30% 30 170
LQH2MCN150M52L 15 3.5 ±30% 30 150
LQH2MCN180M52L 18 4.0 ±30% 30 140
LQH2MCN220M52L 22 5.5 ±30% 30 130
When applied Rated current to the Products, Inductance will be within ±10% of initial Inductance value.
When applied Rated current to the Products ,temperature rise caused by self-generated heat shall be limited to
40 max.
4. Testing Conditions
Unless otherwise specified In case of doubt
Temperature : Ordinary Temperature (15 to 35°C) Temperature
: 20 ± 2°C
Humidity
: Ordinary Humidity (25 to 85 %(RH)) Humidity : 60 to 70 %(RH)
Atmospheric Pressure : 86 to 106 kPa
5.Appearance and Dimensions
Unit Mass (Typical value)
0.009
(
in mm
)
0.6±0.2 0.8±0.2 0.6±0.2
2.0±0.2
1.6±0.2
0.65±0.05
No marking.
0.1 min.
1.0±0.2
SpecNo.JELF243A-0060K-01 P2/7
MURATA MFG.CO., LTD
Reference Only
6.Electrical Performance
No. Item Specification Test Method
6.1 Inductance Inductance shall meet item 3. Measuring Equipment: KEYSIGHT 4192A or equivalent
Measuring Frequency: 1MHz
6.2 DC Resistance DC Resistance shall meet item 3. Measuring Equipment: Digital multi meter
6.3 Self Resonant
Frequency
(S.R.F)
S.R.F shall meet item 3. Measuring Equipment: KEYSIGHT E4991A or equivalent
7.Mechanical Performance
No. Item Specification Test Method
7.1 Shear Test Chip coil shall not be damaged. Substrate: Glass-epoxy substrate
Force: 5N
Hold Duration: 5±1s
7.2 Bending Test Substrate: Glass-epoxy substrate
(100×40×0.8mm)
Speed of Applying Force: 0.5mm / s
Deflection: 2mm
Hold Duration: 5seconds.
(in mm)
7.3 Vibration Oscillation Frequency: 10~55~10Hz for 1 minute
Total Amplitude: 1.5mm
Testing Time: A period of 2 hours in each of 3
mutually perpendicular directions.
(Total 6 hours)
7.4 Solderability The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 80 to 120°C / 10 to 30seconds
Solder Temperature: 245±3°C
Immersion Time: 3±1 s
7.5 Resistance to
Soldering Heat
Appearance:No damage
Inductance Change: within ±5%
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 1 to 2 minutes
Solder Temperature: 270±5°C
Immersion Time: 10±1 s
(for LQH2MCN220M52L : 5±0.5s)
Then measured after exposure in the room
condition for 24±2 hours.
Chip coil
Substrate
45
R230
F
Deflection
45
Product
Pressure jig
SpecNo.JELF243A-0060K-01 P3/7
MURATA MFG.CO., LTD
Reference Only
8.Environmental Performance (It shall be soldered on the substrate.)
No. Item Specification Test Method
8.1 Heat Resistance Appearance:No damage
Inductance Change: within ± 5%
DC Resistance Change:
within ± 5%
Temperature: 85±2°C
Time: 1000± hours
Then measured after exposure in the room
condition for 24±2 hours.
8.2 Cold Resistance Temperature: -40±2°C
Time: 1000± hours
Then measured after exposure in the room
condition for 24±2 hours.
8.3 Humidity Temperature: 40±2°C
Humidity: 90~95%(RH)
Time: 1000± hours
Then measured after exposure in the room
condition for 24±2 hours.
8.4 Temperature
Cycle
1 cycle:
1 step: -40±2°C / 30±3 minutes
2 step: Ordinary temp. / 10 to 15 minutes
3 step: +85±2°C / 30±3 min
4 step: Ordinary temp. / 10 to 15 minutes
Total of 10 cycles
Then measured after exposure in the room
condition for 24±2 hours.
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
Dimension of the Cavity is measured at the bottom side.
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
3,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape 10N min.
Cover tape 10N min.
2.3±0.1
φ
1.5
1.9±0.1
4.0±0.1
2.0±0.05
4.0±0.1
+0.1
-0
1.75±0.1
3.5±0.05
8.0±0.2
0.8±0.1
0.25
Direction of feed
(in mm)
Lead- in/out wire
The packing directions of the chip coil
in taping are unified with the in/out
positions of the lead wire.
( )
48
00
48
00
48
00

LQH2MCN120M52L

Mfr. #:
Manufacturer:
Description:
Fixed Inductors 0806 12uH 20%
Lifecycle:
New from this manufacturer.
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