Small Signal Product
- Fast switching device (t
rr
< 4.0 ns)
- Through-hole mount device type
- DO-34 package (JEDEC DO-204)
- Hermetically sealed glass
- Compression bonded construction
- RoHS compliant
- Solder hot dip Tin (Sn) lead finish
- Cathode indicated by polarity band
- Marking code: 133
SYMBOL UNIT
P
D
mW
W
IV
V
I
O
mA
I
FM
mA
I
FSURGE
A
T
J
o
C
T
STG
o
C
SYMBOL UNIT
B
V
V
V
F
V
I
R
nA
C
j
pF
t
rr
ns
Document Number: DS_S1403003 Version: C15
and leads are readily solderable
DO-34
1SS133M
Taiwan Semiconductor
300mW, Hermetically Sealed Glass Switching Diodes
FEATURES
- All external surfaces are corrosion resistant
4.0
PARAMETER
500
Breakdown Voltage
1.2Forward Voltage
Reverse Leakage Current
Junction Capacitance
Reverse Recovery Time
80
--
--
--
4.0
I
R
=500nA
I
F
=100mA
V
R
=80V
V
R
=0, f=1.0MHz
(Note 1)
Operating Junction Temperature
Notes: 1. Reverse Recovery Test Conditions: I
F
=I
R
=10mA, R
L
=100Ω, I
RR
=1mA
2
450
MIN MAX
Peak Forward Surge Current
90
150
Storage Temperature Range
300
+ 175
VALUE
-65 to +200
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25°C unless otherwise noted)
PARAMETER
Power Dissipation
Working Inverse Voltage
Average Rectified Current
Non-Repetitive Peak Forward Current