ZSSC3135
Datasheet
© 2016 Integrated Device Technology, Inc.
19
January 27, 2016
4 Pin Configuration and Package
Table 4.1 Pin Configuration and Definition
Pin No Pin Name Description Remarks
1
VDDA Positive Analog Supply Voltage Internal analog supply
2
VSSA Negative Analog Supply Voltage Internal analog ground
3
SDA I²C™ Serial Data Digital I/O; internal pull-up to VDDA
4
SCL I²C™ Clock Digital input; internal pull-up to VDDA
5
N.C. Not connected
6
VDD Positive Digital Supply Voltage Internal digital supply
7
VDDE Positive External Supply Voltage High voltage analog supply
8
VSSE Negative External Supply Voltage Ground
9
AOUT Analog Output
and ZACwire
TM
Serial Data
High voltage analog I/O
10
VBN Negative Input from Sensor Bridge Analog input
11
VBR_B Negative Sensor Bridge Supply Voltage Analog I/O
Depending on application circuit, short to VSSA
12
VBP Positive Input from Sensor Bridge Analog input
13
VBR_T Positive Sensor Bridge Supply Voltage Analog I/O
Depending on application circuit, short to VDDA
14
IRTEMP External Temperature Sensor Analog I/O
The standard package of the ZSSC3135 is an RoHS-compliant SSOP14 greenpackage (5.3mm body width)
with a lead pitch of 0.65 mm.
Figure 4.1 ZSSC3135 SSOP14 Pin Diagram
VDDE
VDD
N.C.
SCL
SDA
VSSA
VDDA
VSSE
AOUT
VBN
VBR_B
VBP
VBR_T
IRTEMP
ZSSC
3135BPPPP
LLLLLLLL
14
1
YYWW
B Revision
PPPP Product and Package Code
LLLLLLLL Lot Number
YYWW Date Code (Year, Work Week)
ZSSC3135
Datasheet
© 2016 Integrated Device Technology, Inc.
20
January 27, 2016
5 ESD Protection
All pins have an ESD protection of >2000V according to the Human Body Model (HBM). The pins VDDE, VSSE
and AOUT have an additional ESD protection of >4000V (HBM).
ESD protection is tested with devices in SSOP14 packages during product qualification. The ESD test follows the
Human Body Model with 1.5kOhm/100pF based on MIL 883, Method 3015.7.
6 Quality and Reliability
The ZSSC3135 is qualified according to the AEC-Q100 standard, operating temperature grade 0.
A fit rate <5fit (T=55°C, S=60%) is guaranteed. A typical fit rate of the semiconductor technology used is 2.5fit.
7 Customization
For high-volume applications that require an upgraded or downgraded functionality compared to the ZSSC3135,
IDT can customize the circuit design by adding or removing certain functional blocks.
Please contact IDT for further information.
8 Ordering Information
Product Sales Code Description Package
ZSSC3135BA2T
ZSSC3135 SSOP14 – temperature range -40 to +125°C Tube
ZSSC3135BA2R
ZSSC3135 SSOP14 – temperature range -40 to +125°C Reel
ZSSC3135BA1B
ZSSC3135 die temperature range -40 to +125°C Tested dice on unsawn
wafer
ZSSC3135BA1C
ZSSC3135 die temperature range -40 to +125°C Tested dice on frame
ZSSC3135BE2T
ZSSC3135 SSOP14 – temperature range -40 to +150°C Tube
ZSSC3135BE2R
ZSSC3135 SSOP14 – temperature range -40 to +150°C Reel
ZSSC3135BE1B
ZSSC3135 die temperature range -40 to +150°C Tested dice on unsawn wafer
ZSSC3135BE1C
ZSSC3135 die temperature range -40 to +150°C Tested dice on frame
ZSSC313xKITV1.1
ZSSC313x Evaluation Kit, revision 1.1
, including Evaluation Board,
ZSSC3135 IC samples, USB cable (software can be downloaded
from the product page www.IDT.com/ZSSC3135)
Kit
ZSSC313x Mass
Calibration System V1.1
Modular Mass Calibration System (MSC) for ZSSC313x including
MCS boards, cable, connectors
(software can be downloaded from
the product page www.IDT.com/ZSSC3135)
Kit
ZSSC3135
Datasheet
© 2016 Integrated Device Technology, Inc.
21
January 27, 2016
9 Related Documents
Document
ZSSC3135 Feature Sheet
ZSSC313x Functional Description
ZSSC313x Evaluation Kit Description
ZSSC313x Technical NoteEMC Design Guidelines*
ZSSC313x Technical NoteHigh Voltage Protection*
ZSSC313x Technical Note Die & Package Dimensions**
IDT Wafer Dicing Guidelines
ZSSC313x Temperature Profile Calculation Spread Sheet
ZSSC313x Bandwidth Calculation Spread Sheet**
Visit the ZSSC3135 product page (www.IDT.com/ZSSC3135) or contact your nearest sales office for the latest
version of these documents.
* Documents marked with an asterisk (*) require a login account for access on the web.
** Documents marked with a double asterisk (**) are available only on request.
10 Glossary
Term Description
ADC Analog-to-Digital Converter
AEC Automotive Electronics Council
AFE Analog Front-end
AOUT Analog Output
BAMP Buffer Amplifier
BR Bridge Sensor Signal
CM Command Mode
CMC Calibration Microcontroller
CMOS Complementary Metal Oxide Semiconductor
DAC Digital-to-Analog Converter
DM Diagnostic Mode
EEPROM Electrically Erasable Programmable Read-Only Memory
ESD Electrostatic Device

ZSSC3135BA2R

Mfr. #:
Manufacturer:
IDT
Description:
Sensor Interface Sensor Signal Conditoner
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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