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POWER MOSFET SWITCHING
Switching behavior is most easily modeled and predicted
by recognizing that the power MOSFET is charge
controlled. The lengths of various switching intervals (t)
are determined by how fast the FET input capacitance can
be charged by current from the generator.
The published capacitance data is difficult to use for
calculating rise and fall because drain–gate capacitance
varies greatly with applied voltage. Accordingly, gate
charge data is used. In most cases, a satisfactory estimate of
average input current (I
G(AV)
) can be made from a
rudimentary analysis of the drive circuit so that
t = Q/I
G(AV)
During the rise and fall time interval when switching a
resistive load, V
GS
remains virtually constant at a level
known as the plateau voltage, V
SGP
. Therefore, rise and fall
times may be approximated by the following:
t
r
= Q
2
x R
G
/(V
GG
– V
GSP
)
t
f
= Q
2
x R
G
/V
GSP
where
V
GG
= the gate drive voltage, which varies from zero to V
GG
R
G
= the gate drive resistance
and Q
2
and V
GSP
are read from the gate charge curve.
During the turn–on and turn–off delay times, gate current is
not constant. The simplest calculation uses appropriate
values from the capacitance curves in a standard equation for
voltage change in an RC network. The equations are:
t
d(on)
= R
G
C
iss
In [V
GG
/(V
GG
– V
GSP
)]
t
d(off)
= R
G
C
iss
In (V
GG
/V
GSP
)
The capacitance (C
iss
) is read from the capacitance curve at
a voltage corresponding to the off–state condition when
calculating t
d(on)
and is read at a voltage corresponding to the
on–state when calculating t
d(off)
.
At high switching speeds, parasitic circuit elements
complicate the analysis. The inductance of the MOSFET
source lead, inside the package and in the circuit wiring
which is common to both the drain and gate current paths,
produces a voltage at the source which reduces the gate drive
current. The voltage is determined by Ldi/dt, but since di/dt
is a function of drain current, the mathematical solution is
complex. The MOSFET output capacitance also
complicates the mathematics. And finally, MOSFETs have
finite internal gate resistance which effectively adds to the
resistance of the driving source, but the internal resistance
is difficult to measure and, consequently, is not specified.
The resistive switching time variation versus gate
resistance (Figure 9) shows how typical switching
performance is affected by the parasitic circuit elements. If
the parasitics were not present, the slope of the curves would
maintain a value of unity regardless of the switching speed.
The circuit used to obtain the data is constructed to minimize
common inductance in the drain and gate circuit loops and
is believed readily achievable with board mounted
components. Most power electronic loads are inductive; the
data in the figure is taken with a resistive load, which
approximates an optimally snubbed inductive load. Power
MOSFETs may be safely operated into an inductive load;
however, snubbing reduces switching losses.
GATE-TO-SOURCE OR DRAIN-TO-SOURCE VOLTAGE (VOLTS)
C, CAPACITANCE (pF)
Figure 7. Capacitance Variation
2000
0
V
GS
V
DS
T
J
= 25°C
V
DS
= 0 V
V
GS
= 0 V
C
iss
C
oss
C
rss
C
rss
1600
1200
800
400
2520151050510
C
iss
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DRAIN–TO–SOURCE DIODE CHARACTERISTICS
V
SD
, SOURCE-TO-DRAIN VOLTAGE (VOLTS)
Figure 10. Diode Forward Voltage versus Current
I
S
, SOURCE CURRENT (AMPS)
Figure 9. Resistive Switching Time
Variation versus Gate Resistance
R
G
, GATE RESISTANCE (OHMS)
1 10 100
100
10
1
t, TIME (ns)
V
DD
= 100 V
I
D
= 6.0 A
V
GS
= 10 V
T
J
= 25°C
t
r
td(off)
t
d(on)
V
GS
= 0 V
T
J
= 25°C
Figure 8. Gate–To–Source and Drain–To–Source
Voltage versus Total Charge
160
V
GS
, GATE-TO-SOURCE VOLTAGE (VOLTS)
120
80
40
0
0
6
0
Q
g
, TOTAL GATE CHARGE (nC)
V
DS
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
12
10
2
51015
I
D
= 6.0 A
T
J
= 25°C
Q1
V
GS
Q2
V
DS
Q3
2.0 2.5 3.00.5 1.0 1.5
6
4
3
2
0
20 25
QT
1000
t
f
8
4
1
5
SAFE OPERATING AREA
The Forward Biased Safe Operating Area curves define
the maximum simultaneous drain–to–source voltage and
drain current that a transistor can handle safely when it is
forward biased. Curves are based upon maximum peak
junction temperature and a case temperature (T
C
) of 25°C.
Peak repetitive pulsed power limits are determined by using
the thermal response data in conjunction with the procedures
discussed in AN569, “Transient Thermal
Resistance–General Data and Its Use.”
Switching between the off–state and the on–state may
traverse any load line provided neither rated peak current
(I
DM
) nor rated voltage (V
DSS
) is exceeded and the
transition time (t
r
,t
f
) do not exceed 10 µs. In addition the total
power averaged over a complete switching cycle must not
exceed (T
J(MAX)
– T
C
)/(R
θJC
).
A Power MOSFET designated E–FET can be safely used
in switching circuits with unclamped inductive loads. For
reliable operation, the stored energy from circuit inductance
dissipated in the transistor while in avalanche must be less
than the rated limit and adjusted for operating conditions
differing from those specified. Although industry practice is
to rate in terms of energy, avalanche energy capability is not
a constant. The energy rating decreases non–linearly with an
increase of peak current in avalanche and peak junction
temperature.
Although many E–FETs can withstand the stress of
drain–to–source avalanche at currents up to rated pulsed
current (I
DM
), the energy rating is specified at rated
continuous current (I
D
), in accordance with industry
custom. The energy rating must be derated for temperature
as shown in the accompanying graph (Figure 12). Maximum
energy at currents below rated continuous I
D
can safely be
assumed to equal the values indicated.
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SAFE OPERATING AREA
1.0E-05 1.0E-04 1.0E-02
0.1
1.0
0.01
1.0E-03
1.0E-01 1.0E+00 1.0E+01
0.05
0.01
SINGLE PULSE
0.02
T
J
, STARTING JUNCTION TEMPERATURE (°C)
E
AS
, SINGLE PULSE DRAIN-TO-SOURCE
Figure 12. Maximum Avalanche Energy versus
Starting Junction Temperature
0.1 1000
V
DS
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
1.0
100
AVALANCHE ENERGY (mJ)
I
D
, DRAIN CURRENT (AMPS)
R
DS(on)
LIMIT
THERMAL LIMIT
PACKAGE LIMIT
0.1
0
25 50 75 100 12510
V
GS
= 20 V
SINGLE PULSE
T
C
= 25°C
144
72
36
I
D
= 6.0 A
108
10
1.0 100 150
t,TIME (s)
Figure 13. Thermal Response
r(t), NORMALIZED EFFECTIVE
TRANSIENT THERMAL RESISTANCE
R
θJC
(t) = r(t) R
θJC
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t
1
T
J(pk)
- T
C
= P
(pk)
R
θJC
(t)
P
(pk)
t
1
t
2
DUTY CYCLE, D = t
1
/t
2
Figure 14. Diode Reverse Recovery Waveform
di/dt
t
rr
t
a
t
p
I
S
0.25 I
S
TIME
I
S
t
b
10 ms
1 ms
dc
100 µs
0.1
D = 0.5
0.2
180
0.01

MTP6P20E

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET P-CH 200V 6A TO-220AB
Lifecycle:
New from this manufacturer.
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