DocID13274 Rev 4 5/10
SMA6J Characteristics
10
Figure 4. Junction capacitance versus reverse
applied voltage (typical values) (SMA6JxxA)
Figure 5. Junction capacitance versus reverse
applied voltage (typical values) (SMA6JxxCA)
10
100
1000
10000
1 10 100 1000
C(pF)
F=1MHz
V =30mV
T =25°C
OSC RMS
j
V (V)
R
SMA6J5.0A
SMA6J13A
SMA6J26A
SMA6J58A
SMA6J188A
1
10
100
1000
10000
1 10 100 1000
C(pF)
F=1MHz
V =30mV
T =25°C
OSC RMS
j
V (V)
R
SMA6J5.0CA
SMA6J13CA
SMA6J26CA
SMA6J58CA
SMA6J188CA
Figure 6. Peak forward voltage drop versus
peak forward current (typical values)
Figure 7. Relative variation of thermal
impedance junction to ambient versus pulse
duration (printed ciruit board FR4, S
Cu
= 1 cm
2
)
1.E-02
1.E-01
1.E+00
1.E+01
0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4
I (A)
FM
V (V)
FM
T =25°C
j
T =125°C
j
0.01
0.10
1.00
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z
th(j-a)
/R
th(j-a)
t (S)
p
Figure 8. Thermal resistance junction to
ambient versus copper surface under each lead
(printed circuit board FR4, e
Cu
= 35 µm)
Figure 9. Leakage current versus junction
temperature (typical values)
40
50
60
70
80
90
100
110
120
130
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
S (cm )
CU
2
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
25 50 75 100 125 150 175
I (nA)
R
T (°C)
j
V=
R
V
RM
V 11.7V
BR
≤
V 11.7V
BR
>
