NXP Semiconductors
PMCM6501VPE
12 V, P-channel Trench MOSFET
PMCM6501VPE All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 10 August 2015 9 / 15
Q
G
(nC)
0 252010 155
aaa-019243
-2
-3
-1
-4
-5
V
GS
(V)
0
I
D
= -3 A; V
DS
= -6 V; T
amb
= 25 °C
Fig. 15. Gate-source voltage as a function of gate
charge; typical values
003aaa508
V
GS
V
GS(th)
Q
GS1
Q
GS2
Q
GD
V
DS
Q
G(tot)
I
D
Q
GS
V
GS(pl)
Fig. 16. MOSFET transistor: Gate charge waveform
definitions
V
SD
(V)
0 -1.2-0.8-0.4
aaa-019244
-0.4
-0.8
-1.2
I
S
(A)
0
Tj = 150 °C
Tj = 25 °C
V
GS
= 0 V
Fig. 17. Source current as a function of source-drain voltage; typical values
11. Test information
t
1
t
2
P
t
006aaa812
duty cycle δ =
t
1
t
2
Fig. 18. Duty cycle definition
NXP Semiconductors
PMCM6501VPE
12 V, P-channel Trench MOSFET
PMCM6501VPE All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 10 August 2015 10 / 15
12. Package outline
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
PMCM6501VPE
pmcm6501vpe-ssmos_po
15-07-16
Unit
mm
max
nom
min
0.375 0.215 0.275 1.51 1.01
0.15 0.05
A
Dimensions (mm are the original dimensions)
WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) PMCM6501VPE
A
1
A
2
0.160
b D E e
1
e
2
0.50
v w y
0.050.345 0.200 0.260 1.48 0.98 1.00
e
0.500.145
0.315 0.185 0.245 1.45 0.950.130
0 1 mm
scale
detail X
ball A1
index area
C
e
2
y
C
y
1
X
D
E
A
e
B
e
1
1
2
A CB
b
AC B
v
C
w
A
A
1
A
2
ball A1
index area
Note
Device back is metal coated on Drain potential.
Fig. 19. Package outline WLCSP6 (OL-PMCM6501VPE)
NXP Semiconductors
PMCM6501VPE
12 V, P-channel Trench MOSFET
PMCM6501VPE All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 10 August 2015 11 / 15
13. Soldering
Footprint information for reflow soldering PMCM6501VPE
pmcm6501vpe-ssmos_fr
solder resist
occupied area
solder paste = solderland
Dimensions in mm
0.5
1.7
0.5
0.15
0.35
0 .25
0.25 1.2
Fig. 20. Reflow soldering footprint for WLCSP6 (OL-PMCM6501VPE)

PMCM6501VPEZ

Mfr. #:
Manufacturer:
Nexperia
Description:
MOSFET 12V P-Channel Trench MOSFET
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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