VSKY02300603
www.vishay.com
Vishay Semiconductors
Rev. 1.4, 01-Jun-17
1
Document Number: 85910
For technical questions within your region: DiodesAmericas@vishay.com
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Small Signal Schottky Diode FlipKY
®
Gen 2
DESIGN SUPPORT TOOLS click logo to get started
MECHANICAL DATA
Case: CLP0603-2M
FEATURES
• Schottky diode for high-speed switching
• Very low dimensions:
0.6 mm x 0.3 mm x 0.29 mm
• 0.2 A forward current
• Low forward voltage drop (typ. 435 mV at 0.2 A)
• Low reverse current (< 3 μA at 10 V)
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
PARTS TABLE
PART ORDERING CODE
CIRCUIT
CONFIGURATION
PACKAGE
NAME
TYPE
MARKING
WEIGHT
TAPED UNITS PER REEL
(8 mm TAPE ON 7" REEL)
MINIMUM
ORDER
QUANTITY
VSKY02300603 VSKY02300603-G4-08 Single CLP0603-2M 23 0.115 mg 15 000 15 000
ABSOLUTE MAXIMUM RATINGS (T
amb
= 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage V
R
30 V
Forward continuous current I
F
200 mA
Surge forward current 8.3 ms half sine-wave I
FSM
6A
Power dissipation
Footprint acc. Fig. 4
P
tot
278
mW
Infinite heat sink 1712
THERMAL CHARACTERISTICS (T
amb
= 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Thermal resistance junction to ambient air Acc. JEDEC
®
51-3 with footprint acc. Fig. 4 R
thJA
450
K/W
Thermal resistance junction to soldering point Infinite heat sink R
thJS
73
Maximum operating junction temperature T
j
150
°C
Storage temperature range T
stg
-65 to +150
ELECTRICAL CHARACTERISTICS (T
amb
= 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL TYP. MAX. UNIT
Leakage current
V
R
= 10 V I
R
3
μA
V
R
= 30 V I
R
10
Forward voltage
I
F
= 10 mA V
F
295 350
mVI
F
= 100 mA V
F
385 460
I
F
= 200 mA V
F
435 500
Diode capacitance V
R
= 0 V, f = 1 MHz C
D
33 pF
