13/23
VN920 / VN920-B5 / VN920SO
P
2
PAK PC Board
R
thj-amb
Vs PCB copper area in open box free air condition
P
2
PAK THERMAL DATA
Layout condition of R
th
and Z
th
measurements (PCB FR4 area= 60mm x 60mm, PCB thickness=2mm,
Cu thickness=35µm, Copper areas: 0.97cm
2
, 8cm
2
).
30
35
40
45
50
55
0246810
PCB Cu heatsink area (cm^2)
RTHj_amb (°C/W)
Tj-Tamb=50°C
14/23
VN920 / VN920-B5 / VN920SO
1
SO-16L PC Board
R
thj-amb
Vs PCB copper area in open box free air condition
SO-16L THERMAL DATA
Layout condition of R
th
and Z
th
measurements (PCB FR4 area= 41mm x 48mm, PCB thickness=2mm,
Cu thickness=35µm, Copper areas: 0.5cm
2
, 6cm
2
).
40
45
50
55
60
65
70
01234567
PCB Cu heatsink area (cm^2)
RTH j-amb (°C/W)
15/23
VN920 / VN920-B5 / VN920SO
Thermal fitting model of a single channel HSD
in SO-16L
Pulse calculation formula
Thermal Parameter
Area/island (cm
2
)0.56
R1C/W) 0.02
R2C/W) 0.1
R3 ( °C/W) 2.2
R4C/W) 12
R5C/W) 15
R6C/W) 35 20
C1 (W.s/°C) 0.0015
C2 (W.s/°C) 7.00E-03
C3 (W.s/°C) 1.50E-02
C4 (W.s/°C) 0.14
C5 (W.s/°C) 1
C6 (W.s/°C) 5 8
Z
THδ
R
TH
δ Z
THtp
1 δ()+=
where
δ t
p
T=
SO-16L Thermal Impedance Junction Ambient Single Pulse
0.01
0.1
1
10
100
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
ZTH (°C/W)
0.5 cm
2
6 cm
2
T_amb
C1
R1 R2
C2
R3
C3
R4
C4
R5
C5
R6
C6
Pd
Tj

VN920SO

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
IC DRIVER HIGH SIDE 16-SOIC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union