LTC4307IDD-1#PBF

LTC4307-1
10
43071fa
APPLICATIONS INFORMATION
Figure 3. The LTC4307-1 in HDMI Capacitance Buffering Application
Figure 4. The LTC4307-1 in a Level Shifting and Capacitance Buffering HDMI Application with Backup 3.3V
Figure 4 shows the LTC4307-1 being used for capacitance
buffering and 5V to 3.3V level shifting. In this application,
the EEPROM is powered by a backup 3.3V supply that is
available when the component is turned off. The EDID in
the EEPROM should be available for reading even when
a component’s power is off.
Although the applications shown in this section are for
HDMI receive channels, the LTC4307-1 can also be used
in HDMI transmit channels with equal success as shown
in the Typical Application on the last page of this data
sheet.
LTC4307-1
GND
READY
SDAOUT
SCLOUT
R6
100k
R5
1k
R4
47k
C1
0.1μF
R2
1.8k
R3
100k
R1
1.8k
5V
TO
HDMI
TX IC
SDA
SCL
HPD
DDC/CEC
GROUND
5V
DDC
HDMI SINK
(DIGITAL TV)
HDMI SOURCE
(DVD PLAYER)
R7
10k
R8
10k
R9
10k
R10
10k
43071 F03
3.3V
HDMI
RX IC
EEPROM
HDMI CABLE
V
CC
SCL SDA GND
V
CC
SDAIN
SCLIN
ENABLE
LTC4307-1
GND
READY
SDAIN
SCLIN
R5
100k
R6
10k
R7
10k
C1
0.1μF
R3
47k
R4
47k
R1
1.8k
R2
1.8k
5V
TO
HDMI
TX IC
SDA
SCL
DDC/CEC
GROUND
5V
DDC
HDMI REPEATER
(DIGITAL RECEIVER)
HDMI SOURCE
(DVD PLAYER)
43071 F04
HDMI
RX IC
EEPROMBACKUP 3.3V
HDMI CABLE
V
CC
SWITCHED
3.3V
SCL SDA
V
CC
SDAOUT
SCLOUT
ENABLE
μC
LTC4307-1
11
43071fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.38 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
2.38 ±0.10
(2 SIDES)
14
85
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD8) DFN 1203
0.25 ± 0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
2.15 ±0.05
0.50
BSC
0.675 ±0.05
3.5 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F)
PACKAGE DESCRIPTION
MSOP (MS8) 0307 REV F
0.53 ± 0.152
(.021 ± .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.1016 ± 0.0508
(.004 ± .002)
0.86
(.034)
REF
0.65
(.0256)
BSC
0° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
12
3
4
4.90 ± 0.152
(.193 ± .006)
8
7
6
5
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42 ± 0.038
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
LTC4307-1
12
43071fa
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
FAX: (408) 434-0507
www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2007
LT 0208 REV A • PRINTED IN USA
PART NUMBER DESCRIPTION COMMENTS
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MUX with SMBus Interface
Low R
ON
: 35Ω Single Ended/70Ω Differential, Expandable to 32 Single
or 16 Differential Channels
LTC1427-50 Micropower, 10-Bit Current Output DAC with SMBus
Interface
Precision 50μA ±2.5% Tolerance Over Temperature, Four Selectable
SMBus Addresses, DAC Powers Up at Zero or Midscale
LTC1623 Dual High Side Switch Controller with SMBus Interface Eight Selectable Addresses/16-Channel Capability
LTC1663 SMBus Interface 10-Bit Rail-to-Rail Micropower DAC DNL < 0.75LSB Max, 5-Lead SOT-23 Package
LTC1694/LTC1694-1 SMBus Accelerator Improved SMBus/I
2
C Rise Time, Ensures Data Integrity with Multiple
SMBus/I
2
C Devices
LTC1695 SMBus/I
2
C Fan Speed Controller in ThinSOT
TM
Package 0.75Ω PMOS 180mA Regulator, 6-Bit DAC
LT1786F SMBus Controlled CCFL Switching Regulator 1.25A, 200kHz Floating or Grounded Lamp Confi gurations
LTC1840 Dual I
2
C Fan Speed Controller Two 100μA 8-Bit DACs, Two Tach Inputs, Four GPIO
LTC4300A-1/
LTC4300A-2/
LTC4300A-3
Hot Swappable 2-Wire Bus Buffers LTC4300A-1: Bus Buffer with READY, ACC and ENABLE
LTC4300A-2: Dual Supply Bus Buffer with READY and ACC
LTC4300A-3: Dual Supply Bus Buffer with READY and ENABLE
LTC4301 Supply Independent Hot Swappable 2-Wire Bus Buffer Supply Independent
LTC4301L Hot Swappable 2-Wire Bus Buffer with Low Voltage
Level Translation
Allows Bus Pull-Up Voltages as Low as 1V on SDAIN and SCLIN
LTC4302-1/LTC4302-2 Addressable 2-Wire Bus Buffer Address Expansion, GPIO, Software Controlled
LTC4303/LTC4304 Hot Swappable 2-Wire Bus Buffers with Stuck Bus
Recovery
Provides Automatic Clocking to Free Stuck I
2
C Busses
LTC4305/LTC4306 2-/4-Channel, 2-Wire Bus Multiplexers with
Capacitance Buffering
2/4 Selectable Downstream Busses, Stuck Bus Disconnect, Rise Time
Accelerators, Fault Reporting, ±10kV HBM ESD Tolerance
LTC4307 Low Offset Hot-Swappable 2-Wire Bus Buffer with
Stuck Bus Recovery
60mV Buffer Offset, 30ms Stuck Bus Disconnect and Recovery
ThinSOT is a trademark of Linear Technology Corporation
RELATED PARTS
TYPICAL APPLICATION
LTC4307-1LTC4307-1
GND
GND
READY
SDAIN
SCLIN
READY
SDAOUT
SCLOUT
R6
10k
R3
10k
R4
1.8k
R5
1.8k
R1
10k
R2
10k
R7
10k
C2
0.1μF
C1
0.1μF
43071 TA02
3.3V5V
DDC GROUND
TV (SINK)DVD PLAYER (SOURCE)
<50pF
HDMI RX
IC
HDMI TX
IC
HDMI
CABLE
EEPROM
V
CC
SDAOUT
SCLOUT
V
CC
SDAIN
SCLIN
ENABLE
ENABLE
μC
HDMI Application with LTC4307-1’s Providing Capacitance Buffering
On Both the Transmit and Receive Channels

LTC4307IDD-1#PBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Interface - Signal Buffers, Repeaters Low Offset I2C Bus Buffer
Lifecycle:
New from this manufacturer.
Delivery:
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