PS9306L2-V-E3-AX Datasheet PS9306L2-AX, PS9306L2-V-E3-AX | P16-P18

PS9306L,PS9306L2 Chapter Title

R08DS0017EJ0100 Rev.1.00 Page 16 of 19

Nov 10, 2011

NOTES ON HANDLING

1. Recommended soldering conditions

(1) Infrared reflow soldering

• Peak reflow temperature 260°C or below (package surface temperature)

• Time of peak reflow temperature 10 seconds or less

• Time of temperature higher than 220°C 60 seconds or less

• Time to preheat temperature from 120 to 180°C 120±30 s

• Number of reflows Three

• Flux Rosin flux containing small amount of chlorine (The flux

with a maximum chlorine content of 0.2 Wt% is

recommended.)

120±30 s

(preheating)

220°C

180°C

Package Surface Temperature T (°C)

Time (s)

Recommended Temperature Profile of Infrared Reflow

(heating)

to 10 s

to 60 s

260°C MAX.

120°C

(2) Wave soldering

• Temperature 260°C or below (molten solder temperature)

• Time 10 seconds or less

• Preheating conditions 120°C or below (package surface temperature)

• Number of times One (Allowed to be dipped in solder including plastic mold portion.)

• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine

content of 0.2 Wt% is recommended.)

(3) Soldering by Soldering Iron

• Peak Temperature (lead part temperature) 350°C or below

• Time (each pins) 3 seconds or less

• Flux Rosin flux containing small amount of chlorine (The flux with a

maximum chlorine content of 0.2 Wt% is recommended.)

(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead

(4) Cautions

• Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.

2. Cautions regarding noise

Be aware that when voltage is applied suddenly between the photocoupler’s input and output at startup, the output

transistor may enter the on state, even if the voltage is within the absolute maximum ratings.

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PS9306L,PS9306L2 Chapter Title

R08DS0017EJ0100 Rev.1.00 Page 17 of 19

Nov 10, 2011

USAGE CAUTIONS

1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static

electricity when handling.

2. Board designing

(1) By-pass capacitor of more than 0.1

F is used between V

and GND near device. Also, ensure that the distance

between the leads of the photocoupler and capacitor is no more than 10 mm.

(2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too close

to the input block pattern of the photocoupler.

If the pattern is too close to the input block and coupling occurs, a sudden fluctuation in the voltage on the IGBT

output side might affect the photocoupler’s LED input, leading to malfunction or degradation of characteristics.

(If the pattern needs to be close to the input block, to prevent the LED from lighting during the off state due to

the abovementioned coupling, design the input-side circuit so that the bias of the LED is reversed, within the

range of the recommended operating conditions, and be sure to thoroughly evaluate operation.)

(3) Pin 2 (which is an NC

pin) can either be connected directly to the GND pin on the LED side or left open.

Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may

degrade the internal noise environment of the device.

Note: *1. NC: Non-Connection (No Connection).

3. Make sure the rise/fall time of the forward current is 0.5

s or less.

4. In order to avoid malfunctions, make sure the rise/fall slope of the supply voltage is 3 V/

s or less.

5. Avoid storage at a high temperature and high humidity.

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PS9306L,PS9306L2 Chapter Title

R08DS0017EJ0100 Rev.1.00 Page 18 of 19

Nov 10, 2011

SPECIFICATION OF VDE MARKS LICENSE DOCUMENT

Parameter Symbol Spec. Unit

Climatic test class (IEC 60068-1/DIN EN 60068-1) 40/110/21

Dielectric strength

maximum operating isolation voltage

Test voltage (partial discharge test, procedure a for type test and random test)

= 1.6 × U

IORM.

, P

< 5 pC

IORM

1 130

1 808

peak

Test voltage (partial discharge test, procedure b for all devices)

= 1.875 × U

IORM.

, P

< 5 pC

2 119 Vpeak

Highest permissible overvoltage U

8 000 V

peak

Degree of pollution (DIN EN 60664-1 VDE0110 Part 1) 2

Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11)) CTI 175

Material group (DIN EN 60664-1 VDE0110 Part 1) III a

Storage temperature range T

stg

–55 to +125 °C

Operating temperature range T

–40 to +110 °C

Isolation resistance, minimum value

= 500 V dc at T

= 25°C

= 500 V dc at T

MAX. at least 100°C

Ris MIN.

Safety maximum ratings (maximum permissible in case of fault, see thermal

derating curve)

Package temperature

Current (input current I

, Psi = 0)

Power (output or total power dissipation)

Isolation resistance

= 500 V dc at T

= Tsi

Tsi

Isi

Psi

Ris MIN.

175

400

700

°C

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PS9306L2-V-E3-AX

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Renesas Electronics

Description:

Logic Output Optocouplers High CMR IGBT Gate Drive

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