b4
2x e
E
W
A2
A1
c
2x b2
3x b
E1
D1
D2
L1
R
Q
1 53
D3
der Kunststoffoberflächeder Bauteilunterseite
The convexbowof substrate is typ. < 0.05 mm over plastic
surface level ofdevice bottom side
min max min max
A 4.83 5.21 0.190 0.205
A1 2.59 3.00 0.102 0.118
A2 1.17 2.16 0.046 0.085
b 1.14 1.40 0.045 0.055
b2 1.47 1.73 0.058 0.068
b4 2.54 2.79 0.100 0.110
c 0.51 0.74 0.020 0.029
D 20.80 21.34 0.819 0.840
D1 14.99 15.75 0.590 0.620
D2 1.65 2.03 0.065 0.080
D3 20.30 20.70 0.799 0.815
E 19.56 20.29 0.770 0.799
E1 16.76 17.53 0.660 0.690
e 7.62 BSC 0.300 BSC
L 19.81 21.34 0.780 0.840
L1 2.11 2.59 0.083 0.102
Q 5.33 6.20 0.210 0.244
R
2.54
4.57 0.100 0.180
W
-
0.10
-
0.004
Di
Millimeter Inches
1 2 5
Outlines i4-Pac
IXYS reserves the right to change limits, conditions and dimensions.
20160916dData according to IEC 60747and per semiconductor unless otherwise specified
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