Page 4 ams Datasheet
Document Feedback [v1-11] 2015-Jan-28
AS1310 − Absolute Maximum Ratings
Stresses beyond those listed in Absolute Maximum Ratings may
cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any
other conditions beyond those indicated in Electrical
Characteristics is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device
reliability.
Figure 5:
Absolute Maximum Ratings
Parameter Min Max Units Comments
Electrical Parameters
V
IN
, V
OUT
, EN, LBI, LBO to GND
-0.3 +5 V
LX, REF to GND -0.3
V
OUT
+ 0.3
V
Input Current (latch-up
immunity)
-100 100 mA Norm: JEDEC 78
Electrostatic Discharge
Electrostatic Discharge HBM ±2 kV Norm: MIL 883 E method 3015
Temperature Ranges and Storage Conditions
Thermal Resistance θ
JA
58 ºC/W
Junction Temperature +125 ºC
Storage Temperature Range -55 +125 ºC
Package Body Temperature +260 ºC
The reflow peak soldering
temperature (body temperature)
specified is in accordance with
IPC/JEDEC J-STD-020“Moisture/Reflow
Sensitivity Classification for
Non-Hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded
packages is matte tin (100% Sn).
Humidity non-condensing 5 85 %
Moisture Sensitive Level 1
Represents a maximum floor life
time of unlimited