BLM18HG102SH1D

Spec. No. JENF243A-9104D-01 P.1/9
MURATA MFG.CO., LTD.
Reference Only
GHz Noise Suppression Chip Ferrite Bead BLM18H□□□□SH1
Murata Standard Reference Specification [AEC-Q200]
1. Scope
This reference specification applies to Chip Ferrite Bead for Automotive Electronics BLM18H_SH Series
based on AEC-Q200.
2. Part Numbering
(ex.) BL
M 18 HG 601 S H 1 D
(1) (2) (3) (4) (5) (6) (7) (8) (9)
(1)Product ID (6)Performance
(2)Type (7)Category(for Automotive Electronics)
(3)Dimension (L×) (8)Numbers of Circuit
(4)Characteristics (9)Packaging (D:Taping )
(5)Typical Impedance at 100MHz
3. Rating
Customer
Part Number
MURATA
Part Number
Impedance (Ω)
(Under Standard Testing Condition)
(*1) (refer to below comment)
Rated
Current
(mA)
DC Resistance
(Ω max. )
(*1) (refer to
below
comment)
ESD Ran
k
1C:1kV
at 100MHz
at 1GHz
Initial
Value
s
Values
After
Testing
Typical at 85 at 125
BLM18HG471SH1D 470±25% 400 min. 600 200 0.85 0.95
1C
BLM18HG601SH1D 600±25% 450 min. 700 200 1.0 1.1
BLM18HG102SH1D 1000±25% 750 min. 1000 100 1.6 1.7
BLM18HD471SH1D 470±25% 700 min. 1000 100 1.2 1.3
BLM18HD601SH1D 600±25% 850 min. 1200 100 1.5 1.6
BLM18HD102SH1D 1000±25% 1100 min. 1700 50 1.8 1.9
BLM18HE601SH1D 600±25% 300 min. 600 800 600 0.25 0.30
BLM18HE102SH1D 1000±25% 500min. 1000 600 500 0.35 0.40
BLM18HE152SH1D 1500±25% 750min. 1500 500 400 0.50 0.55
Operating Temperature : -55°C to +125°C Storage Temperature : -55°C to +125°C
(*1)
Standard Testing Conditions
< Unless otherwise specified > < In case of doubt >
Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
4. Style and Dimensions
Equivalent Circuit
Unit Mass (Typical value)
0.005g
(in mm)
5. Marking
No marking.
: Electrode
1.6±0.15
0.8±0.15
0.4±0.2
0.0.15
Resistance element becomes
dominant at high frequencies.
()
Spec. No. JENF243A-9104D-01 P.2/9
MURATA MFG.CO., LTD.
Reference Only
6. Specifications
6-1. Electrical Performance
No. Item Specification Test Method
6-1-1 Impedance Meet item 3. Measuring Frequency : 100MHz±1MHz , 1GHz±1MHz
Measuring Equipment : KEYSIGHT 4291A or the equivalent
Test Fixture : KEYSIGHT 16192A or the equivalent
6-1-2 DC Resistance Meet item 3. Measuring Equipment : Digital multi meter
*Except resistance of the Substrate and Wire
6-2. Mechanical Performance
(based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
No. AEC-Q200 Murata Specification / Deviation
Stress Test Method
3 High
Temperature
Exposure
1000hours at 125 deg C
Set for 24hours at room
temperature, then measured.
Meet Table A after testing.
Table A
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
DC
Resistance
Meet item 3.
4 Temperature Cyclin
g
1000cycles
-55 deg C to +125 deg C
Set for 24hours at room
temperature, then measured.
Meet Table B after testing.
Table B
5 Destructive
Physical Analysis
Per EIA469
No electrical tests
No defects
7 Biased Humidity 1000hours at 85 deg C, 85%RH
Apply max rated current.
Meet Table B after testing.
8 Operational Life Apply 125 deg C 1000hours
Set for 24hours at room
temperature, then measured
Meet Table B after testing.
9
External Visual Visual inspection No abnormalities
10 Physical Dimension Meet ITEM 4
Style and Dimensions
No defects
12 Resistance to
Solvents
Per MIL-STD-202 Method 215 Not Applicable
13 Mechanical Shock
Per MIL-STD-202 Method 213
Condition F
1500g(14.7N)/0.5ms/Half sine
Meet Table A after testing.
14 Vibration 5g's(0.049N) for 20 minutes,
12cycles each of 3 orientations
Test from 10-2000Hz.
Meet Table A after testing.
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
(BLM18HE
Within±50%
DC
Resistance
Meet item 3.
Spec. No. JENF243A-9104D-01 P.3/9
MURATA MFG.CO., LTD.
Reference Only
φ
1.5
1.1max.
Direction of feed
4.0±0.1
4.0±0.1
1.85±0.1
2.0±0.05
3.5±0.05
1.75±0.1
8.0±0.3
+0.1
-0
1.05±0.1
No. AEC-Q200 Murata Specification / Deviation
Stress Test Method
15 Resistance
to Soldering Heat
Solder temperature
260C+/-5 deg C
Immersion time 10s
Pre-heating:150C +/-10 deg,60s to 90s
Meet Table B after testing.
17 ESD
Per AEC-Q200-002 Meet Table A after testing.
ESD Rank:Meet Item 3. (Rating)
18 Solderability
Per J-STD-002
Method b : Not Applicable
95% of the terminations is to be soldered.
19 Electrical
Characterization
Measured : Impedance No defects
20 Flammability Per UL-94 Not Applicable
21 Board Flex Epoxy-PCB 1.6mm
Deflection 2mm(min)
60s minimum holding time
Meet Table A after testing.
22 Terminal Strength
Per AEC-Q200-006
No defects
30 Electrical
Transient
Conduction
Per ISO-7637-2 Not Applicable
7. Specification of Packaging
7-1. Appearance and Dimensions (8mm-wide paper tape)
(in mm)
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide,4mm-pitch continuously and sealed
by top tape and bottom tape.
(2) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point
The base tape and top tape have no spliced point
(4) Cavity
There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.

BLM18HG102SH1D

Mfr. #:
Manufacturer:
Description:
EMI Filter Beads, Chips & Arrays 0603 1Kohms GHz Gen Use Tape
Lifecycle:
New from this manufacturer.
Delivery:
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