DMOS Dual Full-Bridge PWM Motor Driver
With Overcurrent Protection
A4986
7
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
source-side FET gates. A 0.1 μF ceramic capacitor, should be
connected between CP1 and CP2. In addition, a 0.1 μF ceramic
capacitor is required between VCP and VBB, to act as a reservoir
for operating the high-side FET gates.
Capacitor values should be Class 2 dielectric ±15% maximum,
or tolerance R, according to EIA (Electronic Industries Alliance)
specifications.
V
REG
(VREG). This internally-generated voltage is used to
operate the sink-side FET outputs. The nominal output voltage
of the VREG terminal is 7 V. The VREG pin must be decoupled
with a 0.22 μF ceramic capacitor to ground. V
REG
is internally
monitored. In the case of a fault condition, the FET outputs of the
A4986 are disabled.
Capacitor values should be Class 2 dielectric ±15% maximum,
or tolerance R, according to EIA (Electronic Industries Alliance)
specifications.
Shutdown. In the event of a fault, overtemperature (excess T
J
)
or an undervoltage (on VCP), the FET outputs of the A4986 are
disabled until the fault condition is removed. At power-on, the
UVLO (undervoltage lockout) circuit disables the FET outputs
and resets the translator to the Home state.
Sleep Mode (
¯
S
¯
¯
L
¯
¯
E
¯
¯
E
¯
¯
P
¯
). To minimize power consumption
when the motor is not in use, this input disables much of the
internal circuitry including the output FETs, current regulator, and
charge pump. A logic low on the SLEEP pin puts the A4986 into
Sleep mode. When emerging from Sleep mode, in order to allow
the charge pump to stabilize, provide a delay of 1 ms before issu-
ing a logic command.
Mixed Decay Operation. The bridge operates in Mixed
Decay mode, as shown in figures 5 through 7. As the trip point
is reached, the A4986 initially goes into a fast decay mode for
31.25% of the off-time, t
OFF
. After that, it switches to Slow Decay
mode for the remainder of t
OFF
. A timing diagram for this feature
appears in figure 4.
Synchronous Rectification. When a PWM-off cycle is
triggered by an internal fixed-off time cycle, load current recir-
culates in Mixed Decay mode. This synchronous rectification
feature turns on the appropriate FETs during current decay, and
effectively shorts out the body diodes with the low FET R
DS(ON)
.
This reduces power dissipation significantly, and can eliminate
the need for external Schottky diodes in many applications. Syn-
chronous rectification turns off when the load current approaches
zero (0 A), preventing reversal of the load current.
t
Fixed off-time
5 A / div.
t
5 A / div.
Figure 1. Short-to-ground event
Figure 2. Shorted load (OUTxA OUTxB) in
Slow decay mode
Figure 3. Shorted load (OUTxA OUTxB) in Mixed decay mode
Fixed off-time
Fast decay portion
(direction change)
t
5 A / div.
Fault
latched
DMOS Dual Full-Bridge PWM Motor Driver
With Overcurrent Protection
A4986
8
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
I
OUT
I
OUT
t
See Enlargement A
Enlargement A
t
SD
t
FD
t
off
Slow Decay
Mixed Decay
Fast Decay
I
PEAK
70.71
–70.71
0
100.00
–100.00
PHx
INx1
INx2
Symbol Characteristic
t
off
Device fixed off-time
I
PEAK
Maximum output current
t
SD
Slow decay interval
t
FD
Fast decay interval
I
OUT
Device output current
Figure 4. Current Decay Modes Timing Chart
DMOS Dual Full-Bridge PWM Motor Driver
With Overcurrent Protection
A4986
9
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Application Layout
Layout. The printed circuit board should use a heavy ground-
plane. For optimum electrical and thermal performance, the
A4986 must be soldered directly onto the board. On the under-
side of the A4986 package is an exposed pad, which provides a
path for enhanced thermal dissipation. The thermal pad should be
soldered directly to an exposed surface on the PCB. Thermal vias
are used to transfer heat to other layers of the PCB.
In order to minimize the effects of ground bounce and offset
issues, it is important to have a low impedance single-point
ground, known as a star ground, located very close to the device.
By making the connection between the pad and the ground plane
directly under the A4986, that area becomes an ideal location for
a star ground point. A low impedance ground will prevent ground
bounce during high current operation and ensure that the supply
voltage remains stable at the input terminal.
The two input capacitors should be placed in parallel, and as
close to the device supply pins as possible. The ceramic capaci-
tor (CIN1) should be closer to the pins than the bulk capacitor
(CIN2). This is necessary because the ceramic capacitor will be
responsible for delivering the high frequency current components.
The sense resistors, R
Sx
, should have a very low impedance
path to ground, because they must carry a large current while
supporting very accurate voltage measurements by the current
sense comparators. Long ground traces will cause additional
voltage drops, adversely affecting the ability of the comparators
to accurately measure the current in the windings. The SENSEx
pins have very short traces to the R
Sx
resistors and very thick,
low impedance traces directly to the star ground underneath the
device. If possible, there should be no other components on the
sense circuits.
V
DD
V
BB
C2
ROSC
PAD
A4986
C5
C6
C3
C4
R4
R5
C1
OUT2B
OUT1B
OUT2A
OUT1A
VBB2
VBB1
PH1
SENSE2
SENSE1
CP1
GND
PH2
GND
CP2
VCP
VREG
ROSC
VDD
INO2
IN12
IN11
IN01
REF
SLEEP
GND
GND
GND
GND
GND
GND
GND
R4
U1
OUT2B
GND
R5
OUT2A
OUT1A
OUT1B
C3
C4
C5
ROSC
C2
C6
C1
VBB
VDD
CAPACITANCE
BULK
PCB
Thermal Vias
Trace (2 oz.)
Signal (1 oz.)
Ground (1 oz.)
Thermal (2 oz.)
Solder
A4986
LP package configuration

APEK4986SLP-01-T-DK

Mfr. #:
Manufacturer:
Description:
Board Eval Motor Control A4986
Lifecycle:
New from this manufacturer.
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