Document Number: 28152 For technical questions, contact: dc-film@vishay.com
www.vishay.com
Revision: 19-Mar-13 167
MKP 385
AC and Pulse Metallized Polypropylene Film Capacitors
MKP Radial Potted Type
Vishay BCcomponents
Not Recommended for New Design, Use New MKP385
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
HEAT CONDUCTIVITY (G) AS A FUNCTION OF ORIGINAL PITCH AND CAPACITOR BODY THICKNESS IN mW/°C
POWER DISSIPATION AND MAXIMUM COMPONENT TEMPERATURE RISE
The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a function of
the free air ambient temperature.
The power dissipation can be calculated according type detail specification “HQN-384-01/101: Technical Information Film
Capacitors” with the typical tgd of the curves.
The component temperature rise (T) can be measured (see section “Measuring the Component Temperature” for more details)
or calculated by T = P/G:
T = Component temperature rise (°C)
P = Power dissipation of the component (mW)
G = Heat conductivity of the component (mW/°C)
MEASURING THE COMPONENT TEMPERATURE
A thermocouple must be attached to the capacitor body as in:
The temperature is measured in unloaded (T
amb
) and maximum loaded condition (T
c
).
The temperature rise is given by T =T
c
- T
amb
.
To avoid radiation or convection, the capacitor should be tested in a wind-free box.
W
max.
(mm)
HEAT CONDUCTIVITY (mW/°C)
PITCH 10 mm PITCH 15 mm
4.0 6.5 -
5.0 7.5 10
6.0 9.0 11
7.0 - 12
8.5 - 16
10.0 - 18
Thermocouple
