Murata Manufacturing Co., Ltd. CE-017O
8. Do not give this product a strong press-force nor a mechanical shock.
Because such mechanical forces may cause cracking or chipping of this ceramic product.
9. Rapid cooling or heating during soldering is not recommended.
Such treatment may destroy the element.
10. When this product is operated, temperature of some area may be over 100 to 150°C. Be sure that
surrounding parts and inserting material can withstand the temperature. If the surrounding part and
material is kept under such condition, they may be deteriorated or may produce harmful gases (Cl
2
, H
2
S,
NH
3
, SO
X
, NO
X
etc.). And, such harmful gas may deteriorate the element.
11. Do not assemble this product with air-sealing or resin casting. Such sealing may deteriorate the
characteristic or destroy PTC element.
12. Location on Printed Circuit Board(PC Board)
<Component Direction>
Locate this product horizontal to
the direction in which stress acts.
<Mounting Close to Board Separation Line>
Put this product on the PC Board near the Slit,
not near the Perforation Holes.
Keep this product on the PC Board away from
the Separation Line.
Worst ”A”-“C”-“B”-“D” Better
This information may be changed without a previous notice.
