PRG18BB330MS1RB Datasheet PRG18BB470MS1RB, PRG18BB101MS1RB, PRG18BB471MS1RB | P4-P6

Murata Manufacturing Co., Ltd. CE-017O

Notice for use

1. This product is designed for application, which is used under ordinary environment. (room temperature,

normal humidity, normal pressure) Do not expose this to the following environments, because all these

factors can deteriorate the characteristic of this and can cause failure or burn out.

(1) Corrosive gas or deoxidizing gases (Cl

, H

S, NH

, SOx, NOx etc.)

(2) Volatile, flammable gas

(3) Dusty place

(4) Place in a vacuum, reducing or putting pressure

(5) Place in splashed water, or high humidity and dewing place

(6) Salt water, oil, chemical liquid and solvent

(7) Vibratile place

(8) Other place equivalent to the above

2. Limitation of Applications

Please contact us before using our products for the under-mentioned applications requiring especially high

reliability in order to prevent defects which might directly cause damage to other party’s life body or property

(listed below).

(1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment

(4) Power plant control equipment (5) Medical equipment

(6) Transportation equipment (automobiles, trains, ships, etc.) (7) Traffic signal equipment

(8) Disaster prevention / Crime prevention equipment (9) Data-processing equipment

(10) Applications of similar complexity or with reliability requirements comparable to

the applications listed in the above

3. Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that

may be caused by the abnormal function or the failure of our product.

1. Do not apply abnormal voltage/current exceeding the specified maximum value.

Because they may deteriorate or destroy PTC element.

2. Use this product within the specified temperature. A higher temperature may deteriorate

the characteristic or material.

3. The body of this product is not insulated. Please keep an adequate distance to surrounding

components and wiring.

4. Storage conditions

To keep solderability from declining, following storage condition is recommended.

(1) Condition Temperature : -10 to +40°C

Humidity : Less than 75%RH (not dewing condition)

(2) Term: Please use this POSISTOR within 6 months after shipment by first-in and first-out stocking

system.

(3) Handling after seal open: After unpacking of the minimum package, reseal it promptly or store it

inside a sealed container with a drying agent.

(4) Place: Do not store this product in corrosive gas (SOx, Cl etc) or under sunlight.

CAUTION

Notice

This information may be changed without a previous notice.

Murata Manufacturing Co., Ltd. CE-017O

5. Solder and Flux

(1) Solder Paste

Use Sn:Pb=60:40wt% ,Sn:Pb=63:37wt%, Sn:Ag:Cu=96.5:3.0:0.5wt% or equivalent type of solder paste.

Do not use strong acidic flux (with halide content exceeding 0.2wt%).

Use of the solder containing Zn may reduce adhesive strength.

When you use the solder containing Zn, please contact us in advance.

For your reference, we are using

‘63Sn/37Pb RMA9086 90-3-M18’, manufactured by Alpha Metals Japan Ltd.,

’96.5Sn/3.0Ag/0.5Cu M705-GRN360-K2-V’, manufactured by Senju Metal Industry Co.,LTD.

for any Internal tests of this product.

(2) Flux

Use rosin type flux in soldering process.

If below flux is used, some problems might be caused in the product characteristics and reliability.

Please do not use below flux.

• Strong acidic flux (with halide content exceeding 0.2wt%).

• Water-soluble flux(*Water-soluble flux can be defined as non rosin type flux including wash-type flux

and non-wash-type flux.)

6. For removing the flux after soldering, observe the following points in order to avoid deterioration of

the characteristics or any change of the external electrodes quality.

(1) Cleaning Conditions

(2) Drying : After cleaning, dry promptly this product.

7. In your mounting process, observe the following points in order to avoid deterioration of the

characteristics or destruction of this product. The mounting quality of this product may also be affected by

the mounting conditions, shown the points below.

This product is for only reflow soldering. Flow soldering shall not be allowed.

Please mount this product by soldering. When mounted by other methods, such as conductive adhesives,

please contact us in advance.

(1) Standard Land Size

Too big land size gives too much solder paste on the land. It may cause destruction of this product,

because of the mechanical stress especially in the case of board bending.

(2) Printing Conditions of Solder Paste

i. Standard thickness of solder paste printing shall be from 0.15 to 0.20 mm.

ii.After soldering, the solder fillet shall be a height from 0.2 mm to the thickness of this product.

(See the figures below.)

iii.Too much solder gives too strong mechanical stress to this product, such stress may cause cracking

or any mechanical damage. And also, it can destroy the electrical performance of this product.

Solvent

Dipping Cleaning

Ultrasonic Cleaning

2-propanol

Less than 5 min.

at room temp.

Less than 2 min.

at 40°C max.

Less than 1 min.

20W/L max.

Frequency of several 10 kHz

to several 100 kHz.

A sufficient cleaning shall

be applied to remove flux

completely.

0.6~0.8

0.6~0.7

0.6~0.8

(mm)

This information may be changed without a previous notice.

Murata Manufacturing Co., Ltd. CE-017O

(3) Allowable Soldering Temperature and Time

i. Solder within the temperature and time combinations, indicated by the slanted lines in the following

graphs.

ii. The excessive soldering conditions may cause dissolution of metallization or deterioration of

solder-wetting on the external electrode.

iii. In case of repeated soldering, the total accumulated soldering time should be within the range shown

below figure.(For example, Reflow peak temperature : 250°C,twice → The total accumulated

soldering time at 250°C is within 20sec.)

(4) Standard Temperature Profile for Soldering

i. Insufficient preheating may cause a crack on ceramic body.

Difference between preheating temperature and maximum temperature in the profile shall be 100°C.

ii. Rapid cooling by dipping in solvent or by other means is not recommended.

(5) There is a fear of unexpected failures (tombstone, insufficient solder-wetting, etc.) in your mounting

process, caused by the mounting conditions. Please evaluate if this product is

correctly mounted under your mounting conditions.

(6) Conditions with Soldering Iron

When hand soldering by iron is applied, be sure to keep following conditions.

Preheating: 150 +/- 10 °C

1min. to 2 min.

Soldering: 240 °C

20sec.

# : In case of repeated soldering, the total

accumulated soldering time should be

within the range shown above figure (3).

Preheating (in air)

Soldering

Gradual cooling

(in air)

240°C

1~2 min.

20sec.

100

200

Temperature( °C )

Item

Conditions

Preheating

at 150°C for 1 to 2 minute

Temperature of Iron-tip

350°C max.

Soldering Iron Wattage

30W max.

Diameter of Iron-tip

3mm dia. max.

Soldering Time

5sec. max.

Solder

H60A (Sn:Pb=60:40wt%) type ,

H63A (Sn:Pb=63:37wt%) type,

Sn:Ag:Cu=96.5:3.0:0.5wt% or equivalent type.

Flux

Do not use strong acidic flux

(with halide content exceeding 0.2wt%).

Caution

・Do not allow the iron-tip to directly touch the ceramic body.

・Preheat the ceramic body and mounting board.

Time (sec.)

270

260

250

240

230

220

210

200

Temperature ( °C )

This information may be changed without a previous notice.

P1-P3 P4-P6 P7-P7

PRG18BB330MS1RB

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Thermistors - PTC 33Ohm 20%

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PRG18BB330MS1RB

PRG18BB330MS1RB

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