19
LTC1709-8/LTC1709-9
of 1.2V corresponds to a frequency of approximately
220kHz. The nominal operating frequency range of the
LTC1709 is 140kHz to 310kHz.
The phase detector used is an edge sensitive digital type
which provides zero degrees phase shift between the
external and internal oscillators. This type of phase detec-
tor will not lock up on input frequencies close to the
harmonics of the VCO center frequency. The PLL hold-in
range, f
H
, is equal to the capture range, f
C:
f
H
= f
C
= ±0.5 f
O
(150kHz-300kHz)
The output of the phase detector is a complementary pair
of current sources charging or discharging the external
filter network on the PLLFLTR pin. A simplified block
diagram is shown in Figure 7.
If the external frequency (f
PLLIN
) is greater than the oscil-
lator frequency f
0SC
, current is sourced continuously,
pulling up the PLLFLTR pin. When the external frequency
is less than f
0SC
, current is sunk continuously, pulling
down the PLLFLTR pin. If the external and internal fre-
quencies are the same but exhibit a phase difference, the
current sources turn on for an amount of time correspond-
ing to the phase difference. Thus the voltage on the
PLLFLTR pin is adjusted until the phase and frequency of
the external and internal oscillators are identical. At this
stable operating point the phase comparator output is
open and the filter capacitor C
LP
holds the voltage. The
LTC1709 PLLIN pin must be driven from a low impedance
source such as a logic gate located close to the pin.
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If the overload occurs after start-up, the voltage on C
SS
will
continue charging and will provide additional time before
latching off:
t
LO2
(C
SS
• 3V)/(1.2µA) = 2.5 • 10
6
(C
SS
)
This built-in overcurrent latchoff can be overridden by
providing a pull-up resistor, R
SS
, to the RUN/SS pin as
shown in Figure 6. This resistance shortens the soft-start
period and prevents the discharge of the RUN/SS capaci-
tor during a severe overcurrent and/or short-circuit con-
dition. When deriving the 5µA current from V
IN
as in the
figure, current latchoff is always defeated. The diode
connecting this pull-up resistor to INTV
CC
, as in Figure␣ 6,
eliminates any extra supply current during shutdown
while eliminating the INTV
CC
loading from preventing
controller start-up.
Why should you defeat current latchoff? During the
prototyping stage of a design, there may be a problem with
noise pickup or poor layout causing the protection circuit
to latch off the controller. Defeating this feature allows
troubleshooting of the circuit and PC layout. The internal
short-circuit and foldback current limiting still remains
active, thereby protecting the power supply system from
failure. A decision can be made after the design is com-
plete whether to rely solely on foldback current limiting or
to enable the latchoff feature by removing the pull-up
resistor.
The value of the soft-start capacitor C
SS
may need to be
scaled with output voltage, output capacitance and load
current characteristics. The minimum soft-start capaci-
tance is given by:
C
SS
> (C
OUT
)(V
OUT
)(10
-4
)(R
SENSE
)
The minimum recommended soft-start capacitor of C
SS
=
0.1µF will be sufficient for most applications.
Phase-Locked Loop and Frequency Synchronization
The LTC1709 has a phase-locked loop comprised of an
internal voltage controlled oscillator and phase detector.
This allows the top MOSFET turn-on to be locked to the
rising edge of an external source. The frequency range of
the voltage controlled oscillator is ±50% around the
center frequency f
O
. A voltage applied to the PLLFLTR pin Figure 7. Phase-Locked Loop Block Diagram
EXTERNAL
OSC
2.4V
R
LP
10k
C
LP
OSC
DIGITAL
PHASE/
FREQUENCY
DETECTOR
PHASE
DETECTOR
PLLIN
1709 F07
PLLFLTR
50k
20
LTC1709-8/LTC1709-9
The loop filter components (C
LP
, R
LP
) smooth out the
current pulses from the phase detector and provide a
stable input to the voltage controlled oscillator. The filter
components C
LP
and R
LP
determine how fast the loop
acquires lock. Typically R
LP
=10k and C
LP
is 0.01µF to
0.1µF.
Minimum On-Time Considerations
Minimum on-time, t
ON(MIN)
, is the smallest time duration
that the LTC1709 is capable of turning on the top MOSFET.
It is determined by internal timing delays and the gate
charge required to turn on the top MOSFET. Low duty cycle
applications may approach this minimum on-time limit
and care should be taken to ensure that:
t
V
Vf
ON MIN
OUT
IN
()
<
()
If the duty cycle falls below what can be accommodated by
the minimum on-time, the LTC1709 will begin to skip
cycles resulting in variable frequency operation. The out-
put voltage will continue to be regulated, but the ripple
current and ripple voltage will increase.
The minimum on-time for the LTC1709 is generally less
than 200ns. However, as the peak sense voltage de-
creases, the minimum on-time gradually increases. This is
of particular concern in forced continuous applications
with low ripple current at light loads. If the duty cycle drops
below the minimum on-time limit in this situation, a
significant amount of cycle skipping can occur with corre-
spondingly larger ripple current and voltage ripple.
If an application can operate close to the minimum
on-time limit, an inductor must be chosen that has a low
enough inductance to provide sufficient ripple amplitude
to meet the minimum on-time requirement.
As a general
rule, keep the inductor ripple current of each phase equal
to or greater than 15% of I
OUT(MAX)
at V
IN(MAX)
.
Voltage Positioning
Voltage positioning can be used to minimize peak-to-peak
output voltage excursion under worst-case transient load-
ing conditions. The open-loop DC gain of the control loop
is reduced depending upon the maximum load step speci-
fications. Voltage positioning can easily be added to the
LTC1709 by loading the I
TH
pin with a resistive divider
having a Thevenin equivalent voltage source equal to the
midpoint operating voltage of the error amplifier, or 1.2V
(see Figure 8).
The resistive load reduces the DC loop gain while main-
taining the linear control range of the error amplifier. The
worst-case peak-to-peak output voltage deviation due to
transient loading can theoretically be reduced to half or
alternatively the amount of output capacitance can be
reduced for a particular application. A complete explana-
tion is included in Design Solutions 10 or the LTC1736
data sheet. (See www.linear-tech.com)
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I
TH
R
C
R
T1
INTV
CC
C
C
1709 F08
LTC1709
R
T2
Figure 8. Active Voltage Positioning Applied to the LTC1709
Efficiency Considerations
The percent efficiency of a switching regulator is equal to
the output power divided by the input power times 100%.
It is often useful to analyze individual losses to determine
what is limiting the efficiency and which change would
produce the most improvement. Percent efficiency can be
expressed as:
%Efficiency = 100% – (L1 + L2 + L3 + ...)
where L1, L2, etc. are the individual losses as a percentage
of input power.
Although all dissipative elements in the circuit produce
losses, four main sources usually account for most of the
losses in LTC1709 circuits: 1) I
2
R losses, 2) Topside
MOSFET transition losses, 3) INTV
CC
regulator current
and 4) LTC1709 V
IN
current (including loading on the
differential amplifier output).
21
LTC1709-8/LTC1709-9
1) I
2
R losses are predicted from the DC resistances of the
fuse (if used), MOSFET, inductor, current sense resistor,
and input and output capacitor ESR. In continuous mode
the average output current flows through L and R
SENSE
,
but is “chopped” between the topside MOSFET and the
synchronous MOSFET. If the two MOSFETs have approxi-
mately the same R
DS(ON)
, then the resistance of one
MOSFET can simply be summed with the resistances of L,
R
SENSE
and ESR to obtain I
2
R losses. For example, if each
R
DS(ON)
= 10m, R
L
= 10m, and R
SENSE
= 5m, then the
total resistance is 25m. This results in losses ranging
from 2% to 8% as the output current increases from 3A to
15A per output stage for a 5V output, or a 3% to 12% loss
per output stage for a 3.3V output. Efficiency varies as the
inverse square of V
OUT
for the same external components
and output power level. The combined effects of increas-
ingly lower output voltages and higher currents required
by high performance digital systems is not doubling but
quadrupling the importance of loss terms in the switching
regulator system!
2) Transition losses apply only to the topside MOSFET(s),
and are significant only when operating at high input
voltages (typically 12V or greater). Transition losses can
be estimated from:
Transition Loss = (1.7) V
IN
2
I
O(MAX)
C
RSS
f
3) INTV
CC
current is the sum of the MOSFET driver and
control currents. The MOSFET driver current results from
switching the gate capacitance of the power MOSFETs.
Each time a MOSFET gate is switched from low to high to
low again, a packet of charge dQ moves from INTV
CC
to
ground. The resulting dQ/dt is a current out of INTV
CC
that
is typically much larger than the control circuit current. In
continuous mode, I
GATECHG
= (Q
T
+ Q
B
), where Q
T
and Q
B
are the gate charges of the topside and bottom side
MOSFETs.
Supplying INTV
CC
power through the EXTV
CC
switch input
from an output-derived source will scale the V
IN
current
required for the driver and control circuits by the ratio
(Duty Factor)/(Efficiency). For example, in a 20V to 5V
application, 10mA of INTV
CC
current results in approxi-
mately 3mA of V
IN
current. This reduces the mid-current
loss from 10% or more (if the driver was powered directly
from V
IN
) to only a few percent.
4) The V
IN
current has two components: the first is the
DC supply current given in the Electrical Characteristics
table, which excludes MOSFET driver and control cur-
rents; the second is the current drawn from the differential
amplifier output. V
IN
current typically results in a small
(<0.1%) loss.
Other “hidden” losses such as copper trace and internal
battery resistances can account for an additional 5% to
10% efficiency degradation in portable systems. It is very
important to include these “system” level losses in the
design of a system. The internal battery and input fuse
resistance losses can be minimized by making sure that
C
IN
has adequate charge storage and a very low ESR at
the switching frequency. A 50W supply will typically
require a minimum of 200µF to 300µF of capacitance
having a maximum of 10m to 20m of ESR. The
LTC1709 2-phase architecture typically halves this input
capacitance requirement over competing solutions. Other
losses including Schottky conduction losses during dead-
time and inductor core losses generally account for less
than 2% total additional loss.
Checking Transient Response
The regulator loop response can be checked by looking at
the load transient response. Switching regulators take
several cycles to respond to a step in DC (resistive) load
current. When a load step occurs, V
OUT
shifts by an
amount equal to I
LOAD
(ESR), where ESR is the effective
series resistance of C
OUT
(I
LOAD
) also begins to charge or
discharge C
OUT
generating the feedback error signal that
forces the regulator to adapt to the current change and
return V
OUT
to its steady-state value. During this recovery
time V
OUT
can be monitored for excessive overshoot or
ringing, which would indicate a stability problem.
The
availability of the I
TH
pin not only allows optimization of
control loop behavior but also provides a DC coupled and
AC filtered closed loop response test point. The DC step,
rise time, and settling at this test point truly reflects the
closed loop response.
Assuming a predominantly second
order system, phase margin and/or damping factor can be
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LTC1709EG-9#PBF

Mfr. #:
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Analog Devices / Linear Technology
Description:
Switching Voltage Regulators Hi Pwr PolyPhase DC/DC Controllers
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