ICM7555_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 3 August 2009 19 of 22
NXP Semiconductors
ICM7555
General purpose CMOS timer
14.4 Package related soldering information
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2] For PMFP packages hot bar soldering or manual soldering is suitable.
15. Abbreviations
Table 8. Suitability of through-hole mount IC packages for dipping and wave soldering
Package Soldering method
Dipping Wave
CPGA, HCPGA - suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable
[1]
PMFP
[2]
- not suitable
Table 9. Abbreviations
Acronym Description
CMOS Complementary Metal-Oxide Semiconductors
TTL Transistor-Transistor Logic
SCR Silicon-Controlled Rectifier
ICM7555_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 3 August 2009 20 of 22
NXP Semiconductors
ICM7555
General purpose CMOS timer
16. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
ICM7555_2 20090803 Product data sheet - ICM7555_1
Modifications:
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP
Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Provided separate pinning diagrams for SO8 and DIP8 packages (Figure 2 and Figure 3,
respectively).
Added Table 2 “Pin description”.
Table 4 “Limiting values”:
Symbols V
TRIG
, V
CV
, V
TH
, V
RST
are replaced with V
I
(specific pin names are now noted under
Conditions column).
Symbol/parameter “P
DMAX
, maximum power dissipation” replaced with “P, power dissipation” (only
maximum values given).
Symbol/parameter “T
STG
, storage temperature range” replaced with “T
stg
, storage temperature”.
Symbol changed from “T
SOLD
” to “T
sp
, solder point temperature”
Table 5 “Characteristics”:
Symbols f/f, f/V, f/T, have been added for Astable mode timing.
Symbols V
TRIG
, V
CV
, V
TH
, V
RST
are replaced with V
I
(specific pin names are now noted under
Conditions column).
Symbols I
TRIG
, I
TH
, I
RST
are replaced with I
I
(specific pin names are now noted under Conditions
column).
Symbol/parameter “V
DIS
, discharge output voltage” changed to “V
o
, output voltage” (specific pin
name is now noted under Conditions column).
Symbol/parameter “t
R
, rise time of output” changed to “t
r(o)
, output rise time”.
Symbol/parameter “t
F
, fall time of output” changed to “t
f(o)
, output fall time”.
Symbol “F
MAX
” changed to “f
osc
, oscillator frequency”.
Section 11.4 “Astable operation”: changed symbol for duty cycle from “D” to “δ”.
Added Section 12 “Package outline”.
Added soldering information.
Added Section 15 “Abbreviations”.
ICM7555_1 19940831 Product specification ECN 853-1192 13721
dated 1994 Aug 31
-
ICM7555_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 3 August 2009 21 of 22
NXP Semiconductors
ICM7555
General purpose CMOS timer
17. Legal information
17.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL
http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
17.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at
http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.

ICM7555ID,602

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC OSC SGL TIMER 500KHZ 8-SOIC
Lifecycle:
New from this manufacturer.
Delivery:
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