STW20NB50

STW20NB50
N - CHANNEL 500V - 0.22 - 20A - TO-247
PowerMESH MOSFET
TYPICAL R
DS(on)
= 0.22
EXTREMELY HIGH dv/dt CAPABILITY
±
30V GATE TO SOURCE VOLTAGE RATING
100% AVALANCHE TESTED
REPETITIVE AVALANCHE DATA AT 100
o
C
VERY LOW INTRINSIC CAPACITANCES
GATE CHARGE MINIMIZED
DESCRIPTION
Using the latest high voltage technology,
STMicroelectronics has designed an advanced
family of power Mosfets with outstanding
performances. The new patent pending strip
layout coupled with the Company’s proprietary
edge termination structure, gives the lowest
R
DS
(on) per area, exceptional avalanche and
dv/dt capabilities and unrivalled gate charge and
switching characteristics.
APPLICATIONS
HIGH CURRENT, HIGH SPEED SWITCHING
SWITCH MODE POWER SUPPLIES (SMPS)
DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES AND MOTOR DRIVE
®
INTERNAL SCHEMATIC DIAGRAM
October 1999
1
2
3
TO-247
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
DS
Drain-source Voltage (V
GS
= 0) 500 V
V
DGR
Drain- gate Voltage (R
GS
= 20 k)
500 V
V
GS
Gate-source Voltage ± 30 V
I
D
Drain Current (continuous) at T
c
= 25
o
C20A
I
D
Drain Current (continuous) at T
c
= 100
o
C12.7A
I
DM
() Drain Current (pulsed) 80 A
P
tot
Total Dissipation at T
c
= 25
o
C 250 W
Derating Factor 2 W/
o
C
dv/dt(
1
) Peak Diode Recovery voltage slope 4 V/ns
T
stg
Storage Temperature -65 to 150
o
C
T
j
Max. Operating Junction Temperature 150
o
C
(
) Pulse width limited by safe operating area (
1
) I
SD
20A, di/dt
200 A/
µ
s, V
DD
V
(BR)DSS
, Tj
T
JMAX
TYPE V
DSS
R
DS(on)
I
D
STW20NB50 500 V < 0.25 20 A
1/8
Obsolete Product(s) - Obsolete Product(s) Obsolete Product(s) - Obsolete Product(s)
Obsolete Product(s) - Obsolete Product(s) Obsolete Product(s) - Obsolete Product(s)
THERMAL DATA
R
thj-case
R
thj-amb
R
thc-sink
T
l
Thermal Resistance Junction-case Max
Thermal Resistance Junction-ambient Max
Thermal Resistance Case-sink Typ
Maximum Lead Temperature For Soldering Purpose
0.5
30
0.1
300
o
C/W
oC/W
o
C/W
o
C
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
j
max, δ < 1%)
20 A
E
AS
Single Pulse Avalanche Energy
(starting T
j
= 25
o
C, I
D
= I
AR
, V
DD
= 50 V)
1000 mJ
ELECTRICAL CHARACTERISTICS
(T
case
= 25
o
C unless otherwise specified)
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
Breakdown Voltage
I
D
= 250 µA V
GS
= 0
500 V
I
DSS
Zero Gate Voltage
Drain Current (V
GS
= 0)
V
DS
= Max Rating
V
DS
= Max Rating T
c
= 125
o
C
10
100
µA
µA
I
GSS
Gate-body Leakage
Current (V
DS
= 0)
V
GS
= ± 30 V
± 100 nA
ON (
)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
Gate Threshold
Voltage
V
DS
= V
GS
I
D
= 250 µA
345V
R
DS(on)
Static Drain-source On
Resistance
V
GS
= 10 V I
D
= 10 A 0.22 0.25
I
D(on)
On State Drain Current V
DS
> I
D(on)
x R
DS(on)max
V
GS
= 10 V
20 A
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
fs
() Forward
Transconductance
V
DS
> I
D(on)
x R
DS(on)max
I
D
= 10 A 9 13.5 S
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V
DS
= 25 V f = 1 MHz V
GS
= 0 3600
460
55
4700
600
75
pF
pF
pF
STW20NB50
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Obsolete Product(s) - Obsolete Product(s) Obsolete Product(s) - Obsolete Product(s)
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
t
r
Turn-on Time
Rise Time
V
DD
= 250 V I
D
= 10 A
R
G
= 4.7
V
GS
= 10 V
(see test circuit, figure 3)
32
15
43
21
ns
ns
Q
g
Q
gs
Q
gd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V
DD
= 400 V I
D
= 20 A V
GS
= 10 V 85
21
37
110 nC
nC
nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
r(Voff)
t
f
t
c
Off-voltage Rise Time
Fall Time
Cross-over Time
V
DD
= 400 V I
D
= 20 A
R
G
= 4.7
V
GS
= 10 V
(see test circuit, figure 5)
20
25
47
27
33
62
ns
ns
ns
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
(
)
Source-drain Current
Source-drain Current
(pulsed)
20
80
A
A
V
SD
(
) Forward On Voltage I
SD
= 20 A V
GS
= 0 1.6 V
t
rr
Q
rr
I
RRM
Reverse Recovery
Time
Reverse Recovery
Charge
Reverse Recovery
Current
I
SD
= 20 A di/dt = 100 A/
µ
s
V
DD
= 100 V T
j
= 150
o
C
(see test circuit, figure 5)
700
9
25
ns
µ
C
A
(
) Pulsed: Pulse duration = 300
µ
s, duty cycle 1.5 %
(
) Pulse width limited by safe operating area
Safe Operating Area Thermal Impedance
STW20NB50
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STW20NB50

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
MOSFET N-Ch 500 Volt 20 Amp
Lifecycle:
New from this manufacturer.
Delivery:
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