KAF−8300
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16
AC Operating Conditions
Table 11. CLOCK LEVELS
Description Symbol Level Min. Nom. Max. Unit
Effective
Capacitance
Notes
V1 Low Level V1
L
Low −9.5 −9.25 −9.0 V 76 nF 1
V1 High Level V1
H
High 2.4 2.6 2.85 V 1
V2 Low Level V2
L
Low −9.5 −9.25 −9.0 V 81 nF 1
V2 High Level V2
H
High 2.4 2.6 2.8 V 1
RG, H1, H2, Amplitude RG
AMP
H1
AMP
H2
AMP
Amplitude 5.5 6.0 6.5 V RG = 7 pF
H1 = 224 pF
H2 = 168 pF
1
H1L, Amplitude H1L
AMP
Amplitude 7.5 8.0 8.5 V 7 pF 1
H1 Low Level H1
LOW
Low −4.7 −4.5 −4.3 V 1
H1L Low Level H1L
LOW
Low −6.7 −6.5 −6.3 V
H2 Low Level H2
LOW
Low −5.2 −5.0 −4.8 V
RG Low Level RG
LOW
Low 1.8 2.0 2.2 V 1
1. All pins draw less than 10 mA DC current. Capacitance values relative to SUB (substrate).
Table 12. CLOCK VOLTAGE DETAIL CHARACTERISTICS
Description Symbol Min. Nom. Max. Unit Notes
V1 High-Level Variation V1
HH
0.50 1.0 V High-Level Coupling
V2 High-Level Variation V2
HL
0.28 1.0 V High-Level Coupling
V2 Low-Level Variation V2
LH
0.46 1.0 V Low-Level Coupling
V1 Low-Level Variation V1
LL
0.14 1.0 V Low-Level Coupling
V1−V2 Cross-Over V1
CR
−2.0 −0.5 1.0 V Referenced to Ground
H1 High-Level Variation H1
HH
0.30 1.0 V
H1 High-Level Variation H1
HL
0.07 1.0 V
H1 Low-Level Variation H1
LH
0.16 1.0 V
H1 Low-Level Variation H1
LL
0.25 1.0 V
H2 High-Level Variation H2
HH
0.40 1.0 V
H2 High-Level Variation H2
HL
0.06 1.0 V
H2 Low-Level Variation H2
LH
0.10 1.0 V
H2 Low-Level Variation H2
LL
0.27 1.0 V
H1−H2 Cross-Over H1
CR1
−3.0 −1.23 0 V Rising Side of H1
H1−H2 Cross-Over H1
CR2
−3.0 −0.59 0 V Falling Side of H1
H1L High-Lever Variation H1L
HH
0.64 1.0 V
H1L High-Lever Variation H1L
HL
0.32 1.0 V
H1L Low-Lever Variation H1L
LH
0.27 1.0 V
H1L Low-Lever Variation H1L
LL
0.23 1.0 V
H1L−H2 Cross-Over H1L
CR1
−1.0 −3.0 V Rising Side of H1L
RG High-Level Variation RG
HH
0.19 1.0 V
RG High-Level Variation RG
HL
0.20 1.0 V
RG Low-Level Variation RG
LH
0.11 1.0 V
RG Low-Level Variation RG
LL
0.30 1.0 V
1. H1, H2 clock frequency: 28 MHz. The maximum and minimum values in this table are supplied for reference. The actual clock levels were
measured using the KAF−8300 Evaluation Board. Testing against the device performance specifications is performed using the nominal
values.
KAF−8300
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17
Capacitance Equivalent Circuit
Figure 11. Equivalent Circuit Model
V2
H2
C
f
V2
C
f
V1
C
f
H1L
C
f
H2
C
f
H1
C
f
H12
R
H1LH1
V1
SUB
H1L
H1
1. The external pin names are actual pins on this image sensor. See the pinout diagram (Figure 6) for more information.
2. The components shown in this schematic model do not correspond to actual components inside the image sensor.
Notes:
C
f
V12
Table 13.
Parameter Value (Typical) Unit
C
f
V1
61 nF
C
f
V12
15 nF
C
f
V2
67 nF
C
f
H1
153 pF
C
f
H12
36 pF
C
f
H2
97 pF
C
f
H1L
7 pF
R
H1LH1
52
kW
KAF−8300
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18
TIMING
Table 14. REQUIREMENTS AND CHARACTERISTICS
Description Symbol Minimum Nominal Maximum Unit Notes
H1, H2 Clock Frequency f
H
28 MHz 1, 2
V1, V2 Clock Frequency f
V
125 kHz 2
Pixel Period (1 Count) t
e
35.7 ns 2
H1, H2 Set-up Time t
HS
1
ms
H1L−VOUT Delay t
HV
0 3 ns
RG−VOUT Delay t
RV
0 1 ns
Readout Time t
READOUT
340.2 ms 4, 5
Integration Time t
INT
3, 4
Line Time t
LINE
132.2 ms 4
Flush Time t
FLUSH
21.23 ms 6
1. 50% duty cycle values.
2. CTE will degrade above the nominal frequency.
3. Integration time is user specified.
4. Longer times will degrade noise performance.
5. t
READOUT
= t
LINE
2574 lines.
6. See Figure 19 for a detailed description.
Table 15. CLOCK SWITCHING CHARACTERISTICS
Description Symbol Min. Nom. Max. Unit Notes
V1 Rise Time t
V1r
0.26 1
ms
3
V2 Rise Time t
V2r
0.55 1
ms
3
V1 Fall Time t
V1f
0.43 1
ms
3
V2 Fall Time t
V2f
0.31 1
ms
3
V1 Pulse Width t
V1w
5.0
ms
4, 5
V2 Pulse Width t
V2w
3.0
ms
4, 5
H1 Rise Time t
H1r
9.0 10 ns 3
H2 Rise Time t
H2r
6.9 10 ns 3
H1 Fall Time t
H1f
5.8 10 ns 3
H2 Fall Time t
H2r
5.4 10 ns 3
H1−H2 Pulse Width t
H1w
, t
H2w
14 18 22 ns
H1L Rise Time t
H1Lr
1.8 4 ns 3
H1L Fall Time t
H1Lf
2.5 4 ns 3
H1L Pulse Width t
H1Lw
14 19 22 ns
RG Rise Time t
RGr
2.0 4 ns 3
RG Fall Time t
RGf
2.2 4 ns 3
RG Pulse Width t
RGw
6.7 ns 2
1. H1, H2 clock frequency: 28 MHz. The maximum and minimum values in this table are supplied for reference. The actual clock timing was
measured using the KAF−8300 Evaluation Board. Testing against the device performance specifications is performed using the nominal
values.
2. RG should be clocked continuously.
3. Relative to the pulse width (based on 50% of high/low levels).
4. CTE
5. Longer times will degrade noise performance.

KAF-8300-AXC-CB-AA

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Image Sensors FULL FRAME CCD IMAGE SENSOR
Lifecycle:
New from this manufacturer.
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