ADA4898-1/ADA4898-2 Data Sheet
NOISE
To analyze the noise performance of an amplifier circuit, identify
the noise sources, and then determine if each source has a
significant contribution to the overall noise performance of the
amplifier. To simplify the noise calculations, noise spectral densities
were used rather than actual voltages to leave bandwidth out of the
expressions. Noise spectral density, which is generally expressed
in nV/Hz, is equivalent to the noise in a 1 Hz bandwidth.
The noise model shown in Figure 47 has six individual noise
sources: the Johnson noise of the three resistors, the op amp
voltage noise, and the current noise in each input of the amplifier.
Each noise source has its own contribution to the noise at the
output. Noise is generally specified as referring to input (RTI),
but it is often simpler to calculate the noise referred to the
output (RTO) and then divide by the noise gain to obtain the RTI
noise.
GAIN FROM
B TO OUTPUT
= –
R2
R1
GAIN FROM
A TO OUTPUT
=
NOISE GAIN =
NG = 1 +
R2
R1
I
N–
V
N
V
N, R1
V
N, R3
R1
R2
I
N+
R3
4kTR2
4kTR1
4kTR3
V
N, R2
B
A
V
N
2
+ 4kTR3 + 4kTR1
R2
2
R1 + R2
I
N+
2
R3
2
+ I
N–
2
R1 × R2
2
+ 4kTR2
R1
2
R1 + R2 R1 + R2
RTI NOISE =
RTO NOISE = NG × RTI NOISE
V
OUT
+
07037-045
Figure 47. Op Amp Noise Analysis Model
All resistors have a Johnson noise that is calculated by
)(4kBTR
where:
k is Boltzmanns constant (1.38 × 10
−23
J/K).
B is the bandwidth in Hertz.
T is the absolute temperature in Kelvin.
R is the resistance in ohms.
A simple relationship that is easy to remember is that a 50 Ω
resistor generates a Johnson noise of 1 nV/√Hz at 25°C.
In applications where noise sensitivity is critical, care must be
taken not to introduce other significant noise sources to the
amplifier. Each resistor is a noise source. Attention to the
following areas is critical to maintain low noise performance:
design, layout, and component selection. A summary of noise
performance for the amplifier and associated resistors is shown
in Table 8.
CIRCUIT CONSIDERATIONS
Careful and deliberate attention to detail when laying out the
ADA4898-1/ADA4898-2 boards yields optimal performance.
Power supply bypassing, parasitic capacitance, and component
selection all contribute to the overall performance of the
amplifier.
PCB LAYOUT
Because the ADA4898-1/ADA4898-2 have small signal
bandwidths of 65 MHz, it is essential that high frequency board
layout techniques be employed. All ground and power planes
under the pins of the ADA4898-1/ADA4898-2 should be cleared
of copper to prevent the formation of parasitic capacitance between
the input pins to ground and the output pins to ground. A single
mounting pad on a SOIC footprint can add as much as 0.2 pF of
capacitance to ground if the ground plane is not cleared from
under the mounting pads.
POWER SUPPLY BYPASSING
Power supply bypassing for the ADA4898-1/ADA4898-2 has
been optimized for frequency response and distortion
performance. Figure 45 shows the recommended values and
location of the bypass capacitors. Power supply bypassing is
critical for stability, frequency response, distortion, and PSR
performance. The 0.1 µF capacitors shown in Figure 45 should be
as close to the supply pins of the ADA4898-1/ADA4898-2 as
possible. The 10 µF electrolytic capacitors should be adjacent to,
but not necessarily close to, the 0.1 µF capacitors. The capacitor
between the two supplies helps improve PSR and distortion
performance. In some cases, additional paralleled capacitors can
help improve frequency and transient response.
GROUNDING
Ground and power planes should be used where possible. Ground
and power planes reduce the resistance and inductance of the
power planes and ground returns. The returns for the input
and output terminations, bypass capacitors, and R
G
should all
be kept as close to the ADA4898-1/ADA4898-2 as possible. The
output load ground and the bypass capacitor grounds should be
returned to the same point on the ground plane to minimize
parasitic trace inductance, ringing, and overshoot and to
improve distortion performance.
The ADA4898-1/ADA4898-2 package features an exposed paddle.
For optimum electrical and thermal performance, solder this
paddle to a negative supply plane.
Rev. E | Page 16 of 20
Data Sheet ADA4898-1/ADA4898-2
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MS-012-A A
06-02-2011-B
1.27
0.40
1.75
1.35
2.29
2.29
0.356
0.457
4.00
3.90
3.80
6.20
6.00
5.80
5.00
4.90
4.80
0.10 MAX
0.05 NOM
3.81 REF
0.25
0.17
0.50
0.25
45°
COPLANARITY
0.10
1.04 REF
8
1
4
5
1.27 BSC
SEATING
PLANE
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
BOTTOM VIEW
TOP VIEW
0.51
0.31
1.65
1.25
Figure 48. 8-Lead Standard Small Outline Package with Exposed Pad [SOIC_N_EP]
(RD-8-1)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MS-012-A A
06-03-2011-B
1.27
0.40
1.75
1.35
2.41
0.356
0.457
4.00
3.90
3.80
6.20
6.00
5.80
5.00
4.90
4.80
0.10 MAX
0.05 NOM
3.81 REF
0.25
0.17
0.50
0.25
45°
COPLANARITY
0.10
1.04 REF
8
1
4
5
1.27 BSC
SEATING
PLANE
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
BOTTOM VIEW
TOP VIEW
0.51
0.31
1.65
1.25
3.098
Figure 49. 8-Lead Standard Small Outline Package with Exposed Pad [SOIC_N_EP]
(RD-8-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Ordering Quantity
ADA4898-1YRDZ −40°C to +105°C 8-Lead SOIC_N_EP RD-8-1 98
ADA4898-1YRDZ-R7 −40°C to +105°C 8-Lead SOIC_N_EP RD-8-1 1,000
ADA4898-1YRDZ-RL −40°C to +105°C 8-Lead SOIC_N_EP RD-8-1 2,500
ADA4898-2YRDZ −40°C to +105°C 8-Lead SOIC_N_EP RD-8-2 98
ADA4898-2YRDZ-R7 −40°C to +105°C 8-Lead SOIC_N_EP RD-8-2 1,000
ADA4898-2YRD-EBZ Evaluation Board
1
Z = RoHS Compliant Part.
Rev. E | Page 17 of 20
ADA4898-1/ADA4898-2 Data Sheet
NOTES
Rev. E | Page 18 of 20

ADA4898-2YRDZ

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
High Speed Operational Amplifiers High VTG Low Noise Low Distort High Spd
Lifecycle:
New from this manufacturer.
Delivery:
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