NVD6820NLT4G-VF01

© Semiconductor Components Industries, LLC, 2013
March, 2013 Rev. 1
1 Publication Order Number:
NVD6820NL/D
NVD6820NL
Power MOSFET
90 V, 17 mW, 50 A, Single NChannel
Features
Low R
DS(on)
to Minimize Conduction Losses
High Current Capability
Avalanche Energy Specified
AECQ101 Qualified and PPAP Capable
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Parameter
Symbol Value Unit
DraintoSource Voltage V
DSS
90 V
GatetoSource Voltage V
GS
"20 V
Continuous Drain Cur-
rent R
q
JC
(Notes 1 & 3)
Steady
State
T
C
= 25°C
I
D
50
A
T
C
= 100°C 35
Power Dissipation R
q
JC
(Note 1)
T
C
= 25°C
P
D
100
W
T
C
= 100°C 50
Continuous Drain
Current R
q
JA
(Notes 1,
2 & 3)
Steady
State
T
A
= 25°C
I
D
10
A
T
A
= 100°C 7.0
Power Dissipation R
q
JA
(Notes 1 & 2)
T
A
= 25°C
P
D
4.0
W
T
A
= 100°C 2.0
Pulsed Drain Current
T
A
= 25°C, t
p
= 10 ms
I
DM
310 A
Operating Junction and Storage Temperature T
J
, T
stg
55 to
175
°C
Source Current (Body Diode) I
S
50 A
Single Pulse DraintoSource Avalanche
Energy (T
J
= 25°C, V
GS
= 10 V, I
L(pk)
= 31 A,
L = 0.3 mH, R
G
= 25 W)
E
AS
144 mJ
Lead Temperature for Soldering Purposes
(1/8 from case for 10 s)
T
L
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter Symbol Value Unit
JunctiontoCase Steady State (Drain)
R
q
JC
1.5
°C/W
JunctiontoAmbient Steady State (Note 2)
R
q
JA
38
1. The entire application environment impacts the thermal resistance values
shown, they are not constants and are only valid for the particular conditions
noted.
2. Surfacemounted on FR4 board using a 650 mm
2
, 2 oz. Cu pad.
3. Continuous DC current rating. Maximum current for pulses as long as 1
second is higher but is dependent on pulse duration and duty cycle.
DPAK
CASE 369C
STYLE 2
MARKING DIAGRAMS
& PIN ASSIGNMENT
90 V
16.7 mW @ 10 V
R
DS(on)
50 A
I
D
V
(BR)DSS
20.4 mW @ 4.5 V
http://onsemi.com
1
2
3
4
NChannel
D
S
G
1
Gate
2
Drain
3
Source
4
Drain
YWW
68
20LG
Y = Year
WW = Work Week
6820L = Device Code
G = PbFree Package
Device Package Shipping
ORDERING INFORMATION
NVD6820NLT4G DPAK
(PbFree)
2500/Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
NVD6820NL
http://onsemi.com
2
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise noted)
Parameter
Symbol Test Condition Min Typ Max Unit
OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
V
(BR)DSS
V
GS
= 0 V, I
D
= 250 mA
90 V
DraintoSource Breakdown Voltage
Temperature Coefficient
V
(BR)DSS
/T
J
87 mV/°C
Zero Gate Voltage Drain Current I
DSS
V
GS
= 0 V,
V
DS
= 90 V
T
J
= 25°C 1.0 mA
T
J
= 125°C 100
GatetoSource Leakage Current I
GSS
V
DS
= 0 V, V
GS
= "20 V "100 nA
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
V
GS(TH)
V
GS
= V
DS
, I
D
= 250 mA
1.5 2.5 V
Negative Threshold Temperature
Coefficient
V
GS(TH)
/T
J
6.7 mV/°C
DraintoSource On Resistance R
DS(on)
V
GS
= 10 V, I
D
= 20 A 11.6 16.7 mW
V
GS
= 4.5 V, I
D
= 20 A 12.9 20.4
CHARGES, CAPACITANCES AND GATE RESISTANCES
Input Capacitance
C
iss
V
GS
= 0 V, f = 1.0 MHz,
V
DS
= 25 V
4209
pF
Output Capacitance C
oss
253
Reverse Transfer Capacitance C
rss
187
Total Gate Charge Q
G(TOT)
V
GS
= 4.5 V, V
DS
= 72 V,
I
D
= 20 A
44
nC
V
GS
= 10 V, V
DS
= 72 V,
I
D
= 20 A
83
Threshold Gate Charge Q
G(TH)
V
GS
= 10 V, V
DS
= 72 V,
I
D
= 20 A
4.3
GatetoSource Charge Q
GS
12.5
GatetoDrain Charge Q
GD
22
SWITCHING CHARACTERISTICS (Note 5)
TurnOn Delay Time
t
d(on)
V
GS
= 10 V, V
DD
= 72 V,
I
D
= 20 A, R
G
= 2.5 W
19
ns
Rise Time t
r
98
TurnOff Delay Time t
d(off)
36
Fall Time t
f
59
DRAINSOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
V
SD
V
GS
= 0 V,
I
S
= 20 A
T
J
= 25°C 0.84 1.2
V
T
J
= 125°C 0.72
Reverse Recovery Time t
RR
V
GS
= 0 V, dIs/dt = 100 A/ms,
I
S
= 20 A
39
ns
Charge Time ta 27
Discharge Time tb 12
Reverse Recovery Charge Q
RR
55 nC
4. Pulse Test: Pulse Width 300 ms, Duty Cycle 2%.
5. Switching characteristics are independent of operating junction temperatures.
NVD6820NL
http://onsemi.com
3
TYPICAL CHARACTERISTICS
Figure 1. OnRegion Characteristics Figure 2. Transfer Characteristics
V
DS
, DRAINTOSOURCE (V) V
GS
, GATETOSOURCE VOLTAGE (V)
543210
0
20
40
60
100
4.03.53.02.52.0
0
20
40
60
100
Figure 3. OnResistance vs. Gate Voltage Figure 4. OnResistance vs. Drain Current and
Gate Voltage
V
GS
, GATETOSOURCE VOLTAGE (V) I
D
, DRAIN CURRENT (A)
108642
0.010
0.011
0.012
0.013
0.014
0.015
70402010
0.010
0.011
0.012
0.013
0.014
Figure 5. OnResistance Variation with
Temperature
Figure 6. DraintoSource Leakage Current
vs. Voltage
T
J
, JUNCTION TEMPERATURE (°C) V
DS
, DRAINTOSOURCE (V)
150125100502502550
0.4
1.0
1.6
2.2
2.8
9070605040302010
1 k
10 k
100 k
I
D
, DRAIN CURRENT (A)
I
D
, DRAIN CURRENT (A)
R
DS(on)
, DRAINTOSOURCE RESISTANCE (W)
R
DS(on)
, DRAINTOSOURCE
RESISTANCE (Normalized)
I
DSS
, LEAKAGE (nA)
R
DS(on)
, DRAINTOSOURCE RESISTANCE (W)
30 50 60 80
75 175 80
V
GS
= 10 V
T
J
= 25°C
4.5 V
3.8 V
3.6 V
3.4 V
3.2 V
3.0 V
2.8 V
V
DS
10 V
T
J
= 25°C
T
J
= 125°C
T
J
= 55°C
I
D
= 20 A
T
J
= 25°C
T
J
= 25°C
V
GS
= 10 V
V
GS
= 4.5 V
I
D
= 20 A
V
GS
= 10 V
V
GS
= 0 V
T
J
= 125°C
T
J
= 150°C
0.016
0.018
80
80
0.017
0.015
0.016

NVD6820NLT4G-VF01

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET NFET DPAK 90V 50A 17MOHM
Lifecycle:
New from this manufacturer.
Delivery:
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