SP8M9FU6TB

SP8M9
Transistors
1/5
Switching
SP8M9
zFeatures
1) Low on-resistance.
2) Built-in G-S Protection Diode.
3) Small and Surface Mount Package (SOP8).
zApplication
Power switching, DC / DC converter.
zExternal dimensions (Unit : mm)
SOP8
Each lead has same dimensions
5.0±0.2
0.2±0.1
6.0±0.3
3.9±0.15
0.5±0.1
(
1
)
(
4
)
(
8
)
(
5
)
Max.1.75
1.27
0.15
0.4±0.1
1.5±0.1
0.1
zAbsolute maximum ratings (Ta=25°C)
Parameter
V
V
DSS
Symbol
30
V
V
GSS
A
I
D
A
I
DP
A
I
S
A
I
SP
W
P
D
°C
Tch
°C
Tstg
Nchannel Pchannel
Limits
Unit
Drain-source voltage
Gate-source voltage
Drain current
Total power dissipation
Channel temperature
Storage temperature
Continuous
Pulsed
Continuous
Source current
(Body diode)
Pulsed
20
±9.0
±36
1.6
36
2
150
55 to +150
30
20
±5.0
±20
1.6
20
1 Pw10µs, Duty cycle1%
2 MOUNTED ON A CERAMIC BOARD.
1
1
2
zEquivalent circuit
A protection diode is included between the gate and
the source terminals to protect the diode against static
electricity when the product is in use. Use the protection
circuit when the fixed voltages are exceeded.
(1) Tr1 (Nch) Source
(2) Tr1 (Nch) Gate
(3) Tr2 (Pch) Source
(4) Tr2 (Pch) Gate
(5) Tr2 (Pch) Drain
(6) Tr2 (Pch) Drain
(7) Tr1 (Nch) Drain
(8) Tr1 (Nch) Drain
(1) (2) (3) (4)
(8) (7) (6) (5)
2
1
(8) (7)
(1) (2)
2
1
(6) (5)
(3) (4)
1 ESD PROTECTION DIODE
2 BODY DIODE
zThermal resistance (Ta=25°C)
°C / W
Rth (ch-a) 62.5
Parameter
Symbol Limits Unit
Channel to ambient
MOUNTED ON A CERAMIC BOARD.
SP8M9
Transistors
2/5
N-ch
zElectrical characteristics (Ta=25°C)
Parameter Symbol
I
GSS
Y
fs
Min.
Typ. Max.
Unit
Conditions
V
(BR) DSS
I
DSS
V
GS (th)
R
DS (on)
C
iss
C
oss
C
rss
t
d (on)
t
r
t
d (off)
t
f
Q
g
Q
gs
Q
gd
Gate-source leakage
Drain-source breakdown voltage
Zero gate voltage drain current
Gate threshold voltage
Static drain-source on-state
resistance
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Total gate charge
Gate-source charge
Gate-drain charge
Pulsed
10 µA
30 −−V
−−1 µA
1.0 2.5 V
12 18
16 24 m
17 25
7.0 −−S
1190 pF
340
190
pF
10
pF
15
ns
55
ns
22
ns
15
ns
3.0
21 nC
6.1
nC
−−nC
V
GS
=20V, V
DS
=0V
V
DD
15V
I
D
=1mA, V
GS
=0V
V
DS
=30V, V
GS
=0V
V
DS
=10V, I
D
=1mA
I
D
=9.0A, V
GS
=10V
I
D
=9.0A, V
GS
=4.5V
I
D
=9.0A, V
GS
=4V
I
D
=9.0A, V
DS
=10V
V
DS
=10V
V
GS
=0V
f=1MHz
V
GS
=10V
R
L
=3.33
R
G
=10
V
GS
=5V
I
D
=9.0A
I
D
=4.5A, V
DD
15V
zBody diode characteristics (Source-Drain Characteristics) (Ta=25°C)
V
SD
−−1.2 V I
S
=6.4A, V
GS
=0V
Parameter Symbol
Min. Typ. Max.
Unit
Conditions
Forward voltage
Pulsed
SP8M9
Transistors
3/5
P-ch
zElectrical characteristics (Ta=25°C)
Parameter Symbol
I
GSS
Y
fs
Min.
Typ. Max.
Unit
Conditions
V
(BR) DSS
I
DSS
V
GS (th)
R
DS (on)
C
iss
C
oss
C
rss
t
d (on)
t
r
t
d (off)
t
f
Q
g
Q
gs
Q
gd
Gate-source leakage
Drain-source breakdown voltage
Zero gate voltage drain current
Gate threshold voltage
Static drain-source on-state
resistance
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Total gate charge
Gate-source charge
Gate-drain charge
Pulsed
−−10 µA
30 −−V
−−1 µA
1.0 −−2.5 V
30 42
40 56 m
45 63
4.5 −−S
1400 pF
300
230
pF
15
pF
30
ns
80
ns
40
ns
16
ns
3.5
nC
6.5
nC
−−nC
V
GS
= −20V, V
DS
=0V
V
DD
15V
I
D
= 1mA, V
GS
=0V
V
DS
= −30V, V
GS
=0V
V
DS
= −10V, I
D
= −1mA
I
D
= −5.0A, V
GS
= −10V
I
D
= −2.5A, V
GS
= −4.5V
I
D
= −2.5A, V
GS
= −4.0V
I
D
= −2.5A, V
DS
= −10V
V
DS
= −10V
V
GS
=0V
f=1MHz
V
GS
= −10V
R
L
=6
R
G
=10
V
GS
= −5V
I
D
= −5.0A
I
D
= −2.5A, V
DD
15V
zBody diode characteristics (Source-Drain Characteristics) (Ta=25°C)
V
SD
−−1.2 V I
S
= −1.6A, V
GS
=0V
Parameter Symbol
Min. Typ. Max.
Unit
Conditions
Forward voltage
Pulsed

SP8M9FU6TB

Mfr. #:
Manufacturer:
ROHM Semiconductor
Description:
MOSFET SWITCHING Nch/Pch 4V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet