UPC8112TB-EVAL Datasheet UPC8112TB-EVAL, UPC8112TB-E3-A, UPC8112TB-A | P7-P9

μ

PC8112TB

9. STANDARD CHARACTERISTICS FOR REFERENCE

(T

A = +25°C, VCC = VPS = VIFout = 3.0 V, PLOin = −10 dBm, ZS = ZL = 50 Ω)

Parameter Symbol Test Conditions Reference Unit

Conversion Gain CG fRFin = 1.5 GHz, fLOin = 1.6 GHz 13 dB

SSB Noise Figure SSB

•

NF fRFin = 1.5 GHz, fLOin = 1.6 GHz 11 dB

LO Leakage at RF pin LORF fRFin = 900 MHz, fLOin = 1 000 MHz

f

RFin = 1.5 GHz, fLOin = 1.6 GHz

f

RFin = 1.9 GHz, fLOin = 1.66 GHz

−45

−46

−45

dB

RF Leakage at LO pin RFLO fRFin = 900 MHz, fLOin = 1 000 MHz

f

RFin = 1.5 GHz, fLOin = 1.6 GHz

f

RFin = 1.9 GHz, fLOin = 1.66 GHz

−80

−57

−55

dB

LO Leakage at IF pin LOif fRFin = 900 MHz, fLOin = 1 000 MHz

f

RFin = 1.5 GHz, fLOin = 1.6 GHz

f

RFin = 1.9 GHz, fLOin = 1.66 GHz

−32

−33

−30

dB

3rd Order Distortion Input

Intercept Point

Note

IIP

3 fRFin = 900 MHz, fLOin = 1 000 MHz

f

RFin = 1.5 GHz, fLOin = 1.6 GHz

f

RFin = 1.9 GHz, fLOin = 1.66 GHz

−10

−9

−7

dBm

Note IIP

3 is determined by comparing two method; theoretical calculation and cross point of IM3 curve.

IIP3 = (

Δ

IM3 × Pin + CG − IM3) ÷ (

Δ

IM3 − 1) (dBm) [

Δ

IM3: IM3 curve inclination in linear range]

μ

PC8112’s

Δ

IM3 is closer to 3 (theoretical inclination) than

μ

PC2757 and

μ

PC2758 of conventional ICs.

10. TEST CIRCUIT

1 000 pF

50 Ω

C

1

3

2

1

50 Ω

(Top View)

4

5

6

LOinput

GND

RFinput

PS

V

CC

IFoutput

POWER

SAVE

3 V

L

1

C

6

50 Ω

1 000 pF

C

2

C

4,

C

5

Spectrum Analyzer

Signal Generator

Data Sheet P12808EJ3V0DS00

7

μ

PC8112TB

11. ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD

LO

input

RF

input

PS bias

→

Voltage supply

IF

output

Short

Chip

Short Chip = 1 000 pF

GND

C

2

C

1

V

CC

PS

C

4

C

5

L

1

C

6

C

3

Component Number IF 100 MHz Matching IF 240 MHz Matching Remarks

C1 to C5 1 000 pF 1 000 pF CHIP C

C6 5 pF 2 pF CHIP C

L1 330 nH 84 nH CHIP L

EVALUATION BOARD CHARACTERS AND NOTE

(1) 35

μ

m thick double-sided copper clad 35 × 42 × 0.4 mm polyimide board

(2) Back side: GND pattern

(3) Solder plated patterns

(4)

{: Through holes

(5) To mount C

6, pattern should be cut.

Caution Test circuit or print pattern in this sheet is for testing IC characteristics. They are not an

application circuit or recommended system circuit.

In the case of actual system application, external circuits including print pattern and matching

circuit constant of output port should be designed in accordance with IC’s S-parameters and

environmental components.

Remark External circuits of the IC can be referred to following application notes.

• USAGE AND APPLICATION CHARACTERISTICS OF

μ

PC2757,

μ

PC2758, AND

μ

PC8112, 3-V

POWER SUPPLY, 1.9-GHz FREQUENCY DOWN-CONVERTER ICS FOR MOBILE COMMUNICATION

(Document No. P11997E)

Data Sheet P12808EJ3V0DS00

8

μ

PC8112TB

12. TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified, measured on test

circuits)

12.1 Without Signals

12

10

8

6

4

2

0

12

10

8

6

4

2

0

12

10

8

6

4

2

0

Circuit Current I

CC

(mA)

Circuit Current I

CC

(mA)

Circuit Current I

CC

(mA)

1

0

2

3

4

Supply Voltage V

CC

(V)

1

0

2

3

4

PS Pin Applied Voltage V

PS

(V)

1

0

2

3

4

Supply Voltage V

CC

(V)

CIRCUIT CURRENT vs. SUPPLY VOLTAGE

CIRCUIT CURRENT vs.

PS PIN APPLIED VOLTAGE

V

CC

= V

PS

= V

IFout

V

CC

= V

PS

= V

IFout

V

CC

= V

IFout

T

A

= +85°C

T

A

= +25°C

T

A

= –40°C

V

CC

= 3.3 V

V

CC

= 3.0 V

V

CC

= 2.7 V

Data Sheet P12808EJ3V0DS00

9

UPC8112TB-EVAL

UPC8112TB-EVAL

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