19/21
XC6802
Series
Pd vs. Ta
0
200
400
600
800
1000
1200
25 45 65 85 105 125
Ambient Temperature Ta(℃)
Power Dissipation Pd(mW
USP-6C Power Dissipation
Power dissipation data for the USP-6C is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
2
in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125)
Ambient Temperature(℃) Power Dissipation PdmW Thermal Resistance (/W)
25 1000
100
85 400
PACKAGING INFORMATION (Continued)
20/21
XC6802 Series
USP-6EL Power Dissipation
Power dissipation data for the USP-6EL is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
2
in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125)
Ambient Temperature(℃) Power Dissipation PdmW Thermal Resistance (/W)
25 1000
100.00
85 400
Pd-Ta特
0
200
400
600
800
1000
1200
25 45 65 85 105 125
周囲温度Ta(℃)
許容損失PdmW
PACKAGING INFORMATION (Continued)
Pd vs. Ta
Ambient Temperature Ta ()
Power Dissipation Pd (mW)
21/21
XC6802
Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics. Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.

XC6802A42XMR-G

Mfr. #:
Manufacturer:
Torex Semiconductor
Description:
Battery Management 800mA LinearChrgr IC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet