SPB18P06P G
Parameter Symbol Conditions Unit
min. typ. max.
Thermal characteristics
Thermal resistance,
junction - case
R
thJC
- - 1.85 K/W
Thermal resistance,
junction - ambient,leaded
R
thJA
--62
SMD verson, device on PCB:
R
thJA
minimal footprint - - 62 K/W
6 cm
2
cooling area
1)
--40
Electrical characteristics, at T
j
=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V
(BR)DSS
V
GS
=0 V, I
D
=-250 µA
-60 - - V
Gate threshold voltage
V
GS(th)
V
DS
=V
GS
, I
D
=-
1000 µA
-2.1 3 -4
Zero gate voltage drain current
I
DSS
V
DS
=-60 V, V
GS
=0 V,
T
j
=25 °C
- -0.1 -1 µA
V
DS
=-60 V, V
GS
=0 V,
T
j
=150 °C
- -10 -100
Gate-source leakage current
I
GSS
V
GS
=-20 V, V
DS
=0 V
- -10 -100 nA
Drain-source on-state resistance
R
DS(on)
V
GS
=-10 V, I
D
=-13.2 A
- 101 130
mΩ
Transconductance
g
fs
|V
DS
|>2|I
D
|R
DS(on)max
,
I
D
=-13.2 A
510-S
1)
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm
2
(one layer, 70 µm thick) copper area for drain connection.
FCB is vertical without blown air
Values
Rev 1.6 page 2 2012-09-07
