FERD30H60CTS

Characteristics
FERD30H60C
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DocID030944 Rev 1
Figure 7: Thermal resistance junction to ambient versus copper surface under tab for D²PAK
(typical values)
0
10
20
30
40
50
60
70
80
0 5 10 15 20 25 30 35 40
R
th(j-a)
(°C/W)
D²PAK
Epoxy printed board FR4, copper thickness = 35 µm
S
Cu
(cm²)
FERD30H60C
Package information
DocID030944 Rev 1
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2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Cooling method: by conduction (C)
Epoxy meets UL94,V0
Recommended torque value: 0.55 N·m (for TO-220AB)
Maximum torque value: 0.6 N·m (for TO-220AB)
Package information
FERD30H60C
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2.1 TO-220AB package information
Figure 8: TO-220AB package outline

FERD30H60CTS

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Rectifiers Field-Effect Rectifier Diode 60V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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