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FN6526.1
June 24, 2008
Thermal Management
The power dissipation of ISL55016 is about 500mW. The
recommended layout is shown in Figure 31. The ground pad
should be placed under the bottom of the device. At least
two thermal vias are needed to lower the temperature.
Choices of Components
ISL55016 is designed for wide bandwidth applications, from
50MHz to 3GHz. The decoupling and RF choke components
should be chosen carefully for different frequency
applications. Tables 1 and 2 list the components used on the
evaluation board.
Evaluation Board Setup
The Evaluation board is designed to connect directly to the
2-way 180° Power combiner to recombine signals from
-2GHz and allow single-ended assessment with good phase
matching the two differential signals into one single-ended
output. For lower frequencies, a different choice of power
combiner is needed and short matched coaxial cables
should be used to connect to the combiner. This setup is
used on noise figure measurement and differential
OIP2/OIP3 measurements.
TABLE 1. LIST OF COMPONENTS (50MHz~300MHz)
FREQUENCY BAND VALUE
DESCRIPTION/
DIMENSIONS
C1, C2 2200pF 0603
C4, C5 2200pF 0603
L1, L2 2.2µH Multilayer
Ferrite/0603
C3 1nF 0603
C6 0.1µF 1206
R1, R2 27Ω/0Ω 0402
FIGURE 32. |S11| vs FREQUENCY
-30
-25
-20
-15
-10
-5
0
0 0.5G 1.0G 1.5G 2.5G 3.0G
FREQUENCY (Hz)
dB
2.0G
EVAL BOARD WITH
MATCHING NETWORK
PROBE STATION
TABLE 2. LIST OF COMPONENTS (300MHz~3GHz)
FREQUENCY BAND VALUE
DESCRIPTION/
DIMENSIONS
C1, C2 100pF 0603
C4, C5 100pF 0603
L1, L2 100nH Surface
Mount/0402
C3 100pF 0603
C6 0.1µF 1206
R1, R2 27Ω/0Ω 0402
FIGURE 33. EVALUATION BOARD WITH 2-WAY 180° POWER
COMBINER
1
2
3
6
5
4
RF
IN
ISL55016
C1
C2
C5
C4
RF
OUT
RF
C3
L1
L2
R2
R1
+5V
C6
1
2
s
180°
POWER
COMBINER
DIFFERENTIAL
SIGNAL
OUTPUT
ISL55016
