IS61C64AL-10JLI-TR

IS61C64AL ISSI
®
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability
arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any
published information and before placing orders for products.
Integrated Silicon Solution, Inc. — 1-800-379-4774
1
Rev. B
10/23/06
FEATURES
High-speed access time: 10 ns
CMOS low power operation
— 1 mW (typical) CMOS standby
— 125 mW (typical) operating
TTL compatible interface levels
Single 5V power supply
Fully static operation: no clock or refresh
required
Lead-free available
8K x 8 HIGH-SPEED CMOS STATIC RAM
DESCRIPTION
The ISSI IS61C64AL is a very high-speed, low power,
8192-word by 8-bit static RAM. It is fabricated using ISSI's
high-performance CMOS technology. This highly reliable
process coupled with innovative circuit design techniques,
yields access times as fast as 10 ns with low power
consumption.
When CE is HIGH (deselected), the device assumes a
standby mode at which the power dissipation can be
reduced down to 150 µW (typical) with CMOS input levels.
Easy memory expansion is provided by using one Chip
Enable input, CE. The active LOW Write Enable (WE)
controls both writing and reading of the memory.
The IS61C64AL is packaged in the JEDEC standard 28-
pin, 300-mil SOJ, and TSOP.
FUNCTIONAL BLOCK DIAGRAM
A0-A12
CE
OE
WE
8K x 8
MEMORY ARRAY
DECODER
COLUMN I/O
CONTROL
CIRCUIT
GND
VDD
I/O
DATA
CIRCUIT
I/O0-I/O7
OCTOBER 2006
IS61C64AL ISSI
®
2
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
10/23/06
PIN CONFIGURATION
28-Pin SOJ
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
NC
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
VDD
WE
NC
A8
A9
A11
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
PIN DESCRIPTIONS
A0-A12 Address Inputs
CE Chip Enable 1 Input
OE Output Enable Input
WE Write Enable Input
I/O0-I/O7 Input/Output
NC No Connect
VDD Power
GND Ground
TRUTH TABLE
Mode
WEWE
WEWE
WE
CECE
CECE
CE
OEOE
OEOE
OE I/O Operation VDD Current
Not Selected X H X High-Z ISB1, ISB2
(Power-down)
Output Disabled H L H High-Z ICC
Read H L L DOUT ICC
Write L L X DIN ICC
22
23
24
25
26
27
28
1
2
3
4
5
6
7
21
20
19
18
17
16
15
14
13
12
11
10
9
8
OE
A11
A9
A8
NC
WE
VDD
NC
A12
A7
A6
A5
A4
A3
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A0
A1
A2
PIN CONFIGURATION
28-Pin TSOP (Type 1)
1
2
3
4
5
6
7
8
9
10
11
12
IS61C64AL ISSI
®
Integrated Silicon Solution, Inc. — 1-800-379-4774
3
Rev. B
10/23/06
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol Parameter Value Unit
VTERM Terminal Voltage with Respect to GND –0.5 to +7.0 V
TSTG Storage Temperature –65 to +150 °C
PT Power Dissipation 1.5 W
IOUT DC Output Current (LOW) 20 mA
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation of the
device at these or any other conditions above those indicated in the operational sections
of this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect reliability.
OPERATING RANGE
Range Ambient Temperature Speed VDD
(1)
Commercial 0°C to +70°C -10 5V ± 5%
Industrial –40°C to +85°C -10 5V ± 5%
Note:
1. If operated at 12ns, V
DD range is 5V + 10%.
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Symbol Parameter Test Conditions Min. Max. Unit
VOH Output HIGH Voltage VDD = Min., IOH = –4.0 mA 2.4 V
VOL Output LOW Voltage VDD = Min., IOL = 8.0 mA 0.4 V
VIH Input HIGH Voltage 2.2 VDD + 0.5 V
VIL Input LOW Voltage
(1)
–0.3 0.8 V
ILI Input Leakage GND
VIN
VDD Com. –1 1 µA
Ind. –2 2
ILO Output Leakage GND
VOUT
VDD, Com. –1 1 µA
Outputs Disabled Ind. –2 2
Note:
1. V
IL = –3.0V for pulse width less than 10 ns.

IS61C64AL-10JLI-TR

Mfr. #:
Manufacturer:
ISSI
Description:
SRAM 64K 8Kx8 10ns 5V Async SRAM
Lifecycle:
New from this manufacturer.
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