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SIZ790DT-T1-GE3

P1-P3P4-P6P7-P9P10-P12P13-P14
Vishay Siliconix
SiZ790DT
New Product
Document Number: 67669
S11-2380-Rev. B, 28-Nov-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Dual N-Channel 30 V (D-S) MOSFETs with Schottky Diode
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• SkyFET
®
Monolithic TrenchFET
®
Power MOSFETs and Schottky Diode
• 100 % R
g
and UIS Tested
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• System Power
- Notebook
- Server
• POL
• Synchronous Buck
Converter
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
()I
D
(A) Q
g
(Typ.)
Channel-1 30
0.0093 at V
GS
= 10 V
16
a
7.7 nC
0.0130 at V
GS
= 4.5 V
16
a
Channel-2 30
0.0047 at V
GS
= 10 V
35
a
17 nC
0.0059 at V
GS
= 4.5 V
35
a
Ordering Information: SiZ790DT-T1-GE3 (Lead (Pb)-free and Halogen-free)
G
1
G
2
S
2
S
2
D
1
D
1
1
6
5
4
2
3
3.73 mm
6 mm
PowerPAIR
®
6 x 3.7
D
1
S
1
/D
2
Pin 1
Pin 7
D
1
S
2
N-Channel 2
MOSFET
G
1
S
1
/D
2
G
2
Schottky
Diode
N-Channel 1
MOSFET
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257
). The PowerPAIR is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required
to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 67 °C/W for channel-1 and 65 °C/W for channel-2.
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
Parameter Symbol Channel-1 Channel-2 Unit
Drain-Source Voltage
V
DS
30
V
Gate-Source Voltage
V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
16
a
35
a
A
T
C
= 70 °C
16
a
35
a
T
A
= 25 °C
12.9
b, c
23.4
b, c
T
A
= 70 °C
10.3
b, c
18.7
b, c
Pulsed Drain Current (t = 300 µs)
I
DM
70 100
Continuous Source Drain Diode Current
T
C
= 25 °C
I
S
16
a
35
a
T
A
= 25 °C
3.2
b, c
3.8
b, c
Single Pulse Avalanche Current
L = 0.1 mH
I
AS
16 30
Single Pulse Avalanche Energy
E
AS
13 45 mJ
Maximum Power Dissipation
T
C
= 25 °C
P
D
27 48
W
T
C
= 70 °C
17 31
T
A
= 25 °C
3.9
b, c
4.6
b, c
T
A
= 70 °C
2.5
b, c
3
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)
d, e
260
THERMAL RESISTANCE RATINGS
Parameter Symbol
Channel-1 Channel-2
Unit
Typ. Max. Typ. Max.
Maximum Junction-to-Ambient
b, f
t 10 s R
thJA
24 32 20 27
°C/W
Maximum Junction-to-Case (Drain) Steady State
R
thJC
3.5 4.6 2 2.6
www.vishay.com
2
Document Number: 67669
S11-2380-Rev. B, 28-Nov-11
Vishay Siliconix
SiZ790DT
New Product
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes:
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width 300 µs, duty cycle 2 %.
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= 250 µA
Ch-1 30
V
V
GS
= 0 V, I
D
= 250 µA
Ch-2 30
Gate Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA
Ch-1 1 2.2
V
DS
= V
GS
, I
D
= 250 µA
Ch-2 1.1 2.2
Gate Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 20 V
Ch-1 ± 100
nA
Ch-2 ± 100
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 30 V, V
GS
= 0 V
Ch-1 1
µA
V
DS
= 30 V, V
GS
= 0 V
Ch-2 50 200
V
DS
= 30 V, V
GS
= 0 V, T
J
= 55 °C
Ch-1 5
V
DS
= 30 V, V
GS
= 0 V, T
J
= 55 °C
Ch-2 140 1400
On-State Drain Current
b
I
D(on)
V
DS
5 V, V
GS
= 10 V
Ch-1 15
A
V
DS
5 V, V
GS
= 10 V
Ch-2 20
Drain-Source On-State Resistance
b
R
DS(on)
V
GS
= 10 V, I
D
= 15 A
Ch-1 0.0075 0.0093
V
GS
= 10 V, I
D
= 20 A
Ch-2 0.0038 0.0047
V
GS
= 4.5 V, I
D
= 13 A
Ch-1 0.0105 0.0130
V
GS
= 4.5 V, I
D
= 20 A
Ch-2 0.0048 0.0059
Forward Transconductance
b
g
fs
V
DS
= 15 V, I
D
= 15 A
Ch-1 48
S
V
DS
= 15 V, I
D
= 20 A
Ch-2 85
Dynamic
a
Input Capacitance
C
iss
Channel-1
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
Channel-2
V
DS
= 10 V, V
GS
= 0 V, f = 1 MHz
Ch-1 830
pF
Ch-2 1980
Output Capacitance
C
oss
Ch-1 185
Ch-2 455
Reverse Transfer Capacitance
C
rss
Ch-1 80
Ch-2 165
Total Gate Charge
Q
g
V
DS
= 15 V, V
GS
= 10 V, I
D
= 15 A
Ch-1 15.6 24
nC
V
DS
= 15 V, V
GS
= 10 V, I
D
= 20 A
Ch-2 36 54
Channel-1
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 15 A
Channel-2
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 20 A
Ch-1 7.7 12
Ch-2 17 26
Gate-Source Charge
Q
gs
Ch-1 2.6
Ch-2 5.7
Gate-Drain Charge
Q
gd
Ch-1 3
Ch-2 5
Gate Resistance
R
g
f = 1 MHz
Ch-1 0.2 1 2
Ch-2 0.2 0.9 1.8
Document Number: 67669
S11-2380-Rev. B, 28-Nov-11
www.vishay.com
3
Vishay Siliconix
SiZ790DT
New Product
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes:
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width 300 µs, duty cycle 2 %.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Dynamic
a
Tu r n - On D e l ay T i m e
t
d(on)
Channel-1
V
DD
= 15 V, R
L
= 1.5
I
D
10 A, V
GEN
= 4.5 V, R
g
= 1
Channel-2
V
DD
= 15 V, R
L
= 1.5
I
D
10 A, V
GEN
= 4.5 V, R
g
= 1
Ch-1 10 20
ns
Ch-2 20 40
Rise Time
t
r
Ch-1 15 30
Ch-2 15 30
Turn-Off Delay Time
t
d(off)
Ch-1 15 30
Ch-2 25 50
Fall Time
t
f
Ch-1 7 15
Ch-2 10 20
Tu r n - On D e l a y T i m e
t
d(on)
Channel-1
V
DD
= 15 V, R
L
= 1.5
I
D
10 A, V
GEN
= 10 V, R
g
= 1
Channel-2
V
DD
= 15 V, R
L
= 1.5
I
D
10 A, V
GEN
= 10 V, R
g
= 1
Ch-1 5 10
Ch-2 10 20
Rise Time
t
r
Ch-1 15 30
Ch-2 10 20
Turn-Off Delay Time
t
d(off)
Ch-1 17 35
Ch-2 25 50
Fall Time
t
f
Ch-1 7 15
Ch-2 10 20
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
Ch-1 16
A
Ch-2 35
Pulse Diode Forward Current
a
I
SM
Ch-1 70
Ch-2 100
Body Diode Voltage
V
SD
I
S
= 10 A, V
GS
= 0 V
Ch-1 0.8 1.2
V
I
S
= 2 A, V
GS
= 0 V
Ch-2 0.38 0.48
Body Diode Reverse Recovery Time
t
rr
Channel-1
I
F
= 10 A, dI/dt = 100 A/µs, T
J
= 25 °C
Channel-2
I
F
= 10 A, dI/dt = 100 A/µs, T
J
= 25 °C
Ch-1 15 30
ns
Ch-2 20 40
Body Diode Reverse Recovery Charge
Q
rr
Ch-1 6 12
nC
Ch-2 15 32
Reverse Recovery Fall Time
t
a
Ch-1 9
ns
Ch-2 10.5
Reverse Recovery Rise Time
t
b
Ch-1 6
Ch-2 9.5
P1-P3P4-P6P7-P9P10-P12P13-P14

SIZ790DT-T1-GE3

Mfr. #:
Buy SIZ790DT-T1-GE3
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 30V Vds 20V Vgs PowerPAIR 6 x 3.7
Lifecycle:
New from this manufacturer.
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