Spec No. JEFL243C–0017H-01 P 3/10
MURATA MFG CO.,LTD.
Reference Only
8. Mechanical Performance
No. Item Specifications Test Method
8.1 Appearance and
Dimensions
Meet item 5. Visual Inspection and measured with Slide
Calipers.
8.2 Bonding Strength
and
Core Strength
No evidence of chipping,breakage.
No evidence of coming off
glass-epoxy substrate.
Applying Force (F) : 10N
Applying Time : 5±1s
8.3 Body strength No evidence of chipping,breakage. Applying Force (F) : 10N
Applying Time : 5±1s
8.4 Bending
Strength
Meet Table 1.
Table 1
Substrate : Glass-epoxy (t=1.6mm)
Deflection : 2mm
Keeping Time : 30 s
Speed of Applying Force : 0.5 mm/s
Appearance No damaged.
Impedance
change
(at 10MHz)
within ± 20%
I.R. 10MΩ min.
Withstanding
Voltage
No damaged.
8.5 Vibration Products shall be soldered on the substrate.
Oscillation Frequency : 10 to 55 to 10Hz for 1 min.
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of
3 mutually perpendicular
directions(Total 6 hours).
8.6 Drop Products shall be dropped concrete or steel board.
Method : free fall
Height : 1m
The Number of Times : 10 Times
8.7 Solderability The electrodes shall be at least
90% covered with new solder
coating.
Flux : Ethanol solution of rosin,25(wt)%
Pre heating : 150 ± 10°C, 1 minute.
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 245±5°C
Immersion Time : 4±1s
Immersion and Immersion rates : 25mm/s
8.8 Resistance to
Soldering heat
Meet Table 1. Flux : Ethanol solution of rosin,25(wt)%
Pre heating : 150 ± 10°C, 1 minute.
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270 ± 5°C
Immersion Time : 5±1s
Immersion and Immersion rates : 25mm/s
Then measured after exposure in the room
condition for 4 to 48 hours.
45
R340
F
Deflection
45
Product
Pressure jig
(in mm)
Pressure jig
F
Product
Substrate
Test board fixture
F
Nozzle
Product
Substrate
Test board fixture
Stainless
Product
tweezers
