ADG787
Rev. A | Page 15 of 16
SEATING
PLANE
0.50 BSC
BALL PITCH
1.56
1.50
1.44
0.26
0.22
0.18
0.11
0.09
0.07
0.36
0.32
0.28
0.63
0.57
0.51
BOTTOM
VIEW
(BALL SIDE UP)
2.06
2.00
1.94
TOP VIEW
(BALL SIDE DOWN)
1
ABC
2
3
4
BALL 1
IDENTIFIER
111105-0
Figure 40. 10-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-10)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding
1
ADG787BRMZ
2
–40°C to +85°C 10-Lead Mini Small Outline Package (MSOP) RM-10 SM1
ADG787BRMZ-500RL7
2
–40°C to +85°C 10-Lead Mini Small Outline Package (MSOP) RM-10 SM1
ADG787BRMZ-REEL
2
–40°C to +85°C 10-Lead Mini Small Outline Package (MSOP) RM-10 SM1
ADG787BCBZ-500RL7
2
–25°C to +85°C 10-Ball Wafer Level Chip Scale Package (WLCSP) CB-10 S04
ADG787BCBZ-REEL
2
–25°C to +85°C 10-Ball Wafer Level Chip Scale Package (WLCSP) CB-10 S04
ADG787BCPZ-500RL7
2
–40°C to +85°C 10-Lead Lead Frame Chip Scale Package (LFCSP_WD) CP-10-9 SM1
ADG787BCPZ-REEL
2
–40°C to +85°C 10-Lead Lead Frame Chip Scale Package (LFCSP_WD) CP-10-9 SM1
1
Due to space constraints, branding on this package is limited to three characters.
2
Z = Pb-free part.
