ADG787
Rev. A | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter Rating
V
DD
to GND −0.3 V to +6 V
Analog Inputs
1
, Digital Inputs
−0.3 V to V
DD
+ 0.3 V or
30 mA (whichever
occurs first)
Peak Current, S or D
5 V Operation 300 mA
3.3 V Operation
200 mA (pulsed at 1 ms,
10% duty cycle max)
Continuous Current, S or D
5 V Operation 100 mA
3.3 V Operation 80 mA
Operating Temperature Range
Extended Industrial (B Version)
MSOP and LFCSP packages −40°C to +85°C
Industrial (B version)
WLCSP package −25°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
WLCSP Package (4-Layer Board)
θ
JA
Thermal Impedance 120°C/W
LFCSP Package (4-Layer Board)
θ
JA
Thermal Impedance 61°C/W
MSOP Package (4-Layer Board)
θ
JA
Thermal Impedance 142°C/W
θ
JC
Thermal Impedance 43.7°C/W
Lead-Free Temperature Soldering
IR Reflow, Peak Temperature
Peak Temperature 260(+0/−5)°C
Time at Peak Temperature 10 sec to 40 sec
1
Overvoltages at the IN, S, or D pins are clamped by internal diodes. Current
should be limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any one
time.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.