Tflex
™
200T V0 Series
Thermal Gap Filler
FEATURES
• Thermal Conducvity 1.5 W/mK
• Compliant Elastomeric based thin interface
material
• Available in 0.008-inch (0.2mm), 0.010-inch
(0.25mm), 0.012-inch (0.30mm), 0.015-
inch (0.38mm) , and 0.020-inch (0.51mm)
thicknesses
• Slightly tacky for adhesion during assembly
and transport
• Compeve price for high volume
applicaons
• Available as individual custom parts, sheets,
or custom parts converted on a roll
THIN THERMALLY CONDUCTIVE ELASTOMERIC
INTERFACE MATERIAL
Tex™ 200T V0 is a specially formulated thin gap ller thermal interface material designed for
thin interfaces that require a combinaon good thermal performance with great reliability. The
elastomeric property of Tex™ 200T V0 provides good thermal performance in a thin interface
where reliability and shock and vibraon consideraons are crical performance consideraons
in addion to low thermal resistance.
Tex™ 200T V0’s unique silicone and ceramic ller technology allows a combinaon of great
reliability, good thermal performance, and easy handling.
APPLICATIONS
• Memory Modules: DDR2, DDR3, SDRAM,
SRAM, RAM, NVRAM
• LED solid state lighng
• Power electronics
Americas: +1.800.843.4556
Europe: +49.8031.24600
Asia: +86.755.2714.116
CLV-customerservice@lairdtech.com