A16707-20

Tflex
200T V0 Series
Thermal Gap Filler
FEATURES
Thermal Conducvity 1.5 W/mK
Compliant Elastomeric based thin interface
material
Available in 0.008-inch (0.2mm), 0.010-inch
(0.25mm), 0.012-inch (0.30mm), 0.015-
inch (0.38mm) , and 0.020-inch (0.51mm)
thicknesses
• Slightly tacky for adhesion during assembly
and transport
• Compeve price for high volume
applicaons
• Available as individual custom parts, sheets,
or custom parts converted on a roll
THIN THERMALLY CONDUCTIVE ELASTOMERIC
INTERFACE MATERIAL
Tex™ 200T V0 is a specially formulated thin gap ller thermal interface material designed for
thin interfaces that require a combinaon good thermal performance with great reliability. The
elastomeric property of Tex™ 200T V0 provides good thermal performance in a thin interface
where reliability and shock and vibraon consideraons are crical performance consideraons
in addion to low thermal resistance.
Tex™ 200T V0’s unique silicone and ceramic ller technology allows a combinaon of great
reliability, good thermal performance, and easy handling.
APPLICATIONS
Memory Modules: DDR2, DDR3, SDRAM,
SRAM, RAM, NVRAM
• LED solid state lighng
• Power electronics
Americas: +1.800.843.4556
Europe: +49.8031.24600
Asia: +86.755.2714.116
CLV-customerservice@lairdtech.com
Tflex
200T V0 Series
Thermal Gap Filler
THR-DS-TFLEX-200T-V0_0714
Any informaon furnished by Laird Technologies and its agents is believed to be accurate and reliable. Responsibility for the use and applicaon of Laird Technologies materials rests with the end user
since Laird Technologies and its agents cannot be aware of all potenal uses. Laird Technologies makes no warranes as to the tness, merchantability, or suitability of any Laird Technologies materials
or products for any specic or general uses. Laird Technologies shall not be liable for incidental or consequenal damages of any kind. All Laird Technologies products are sold pursuant to the Laird
Technologies terms and condions of sale in eect from me to me, a copy of which will be furnished upon request.damages of any kind. All Laird Technologies’ products are sold pursuant to the Laird
Technologies’ terms and condions of sale in eect from me to me, a copy of which will be furnished upon request. A15922-00 Rev D., 07/14. © 2014 All Rights Reserved. Laird Technologies is a
registered trademark of Laird Technologies, Inc.
8 MIL 10 MIL 15 MIL TEST METHOD
Construcon &
Composion
Ceramic lled
silicone elastomer,
reinforced
Ceramic lled
silicone elastomer,
reinforced
Ceramic lled
silicone elastomer,
reinforced
Color Light Grey Light Grey Light Grey Visual
Thickness
0.008”
(0.203mm)
0.010”
(0.254mm)
0.015”
(0.381mm)
Thickness tolerance
±0.0015”
(±0.038mm)
±0.0015”
(±0.038mm)
±0.00225”
(±0.057mm)
Specic Gravity
(Density)
2.32 g/cc 2.32 g/cc 2.32 g/cc
Helium
Pycnometer
Hardness 3 seconds
(Shore 00)
55 55 55 ASTM D2240
Outgassing TML
(Post Cured)
0.38% 0.38% 0.38% ASTM E595
Outgassing CVCM
(Post Cured )
0.11% 0.11% 0.11% ASTM E595
UL Flammability
Rang
94 V0 94 V0 94 V0 E180840
Temperature Range -45°C to 200°C -45°C to 200°C -45°C to 200°C
Thermal Conducvity 1.5 W/mK 1.5 W/mK 1.5 W/mK Hot Disk
Thermal Impedance
@ 10 psi
@ 69 KPa
0.384°C-in²/W
2.48°C-cm²/W
0.488°C-in²/W
3.14°C-cm²/W
0.714°C-in²/W
4.60°C-cm²/W
ASTM D5470
(modied)
Thermal Expansion
(30-150°C)
231.19ppm/°C 231.19ppm/°C 231.19ppm/°C
IPC-TM-650
2.4 2.4
Volume Resisvity 3.5x10
10
ohm-cm 3.5x10
10
ohm-cm 3.5x10
10
ohm-cm ASTM D257
Dielectric Constant @
1 MHz
5.0 5.1 5.1 ASTM D150
Data for design engineer guidance only. Observed performance varies in applicaon.
Engineers are reminded to test the material in applicaon.

A16707-20

Mfr. #:
Manufacturer:
Laird Performance Materials
Description:
Thermal Interface Products TFlex 220T V0,DC1,NA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union