MAX8685DETA+T

RELIABILITY REPORT
FOR
MAX8685AETD+
PLASTIC ENCAPSULATED DEVICES
July 9, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
MAX8685AETD+
Approved by
Richard Aburano
Quality Assurance
Manager, Reliability Operations
Maxim Integrated Products. All rights reserved. Page 1/5
Conclusion
MAX8685AETD+
The MAX8685AETD+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description V. ........Quality Assurance Information
II. ........Manufacturing Information VI. .......Reliability Evaluation
III. .......Packaging Information IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX8685 family charges high-voltage photoflash capacitors quickly, while limiting peak drain from the battery, through an efficient flyback
switching regulator. The internal n-channel MOSFET improves efficiency over competing bipolar designs by lowering switch-voltage dropout. An
integrated insulated gate bipolar transistor (IGBT) driver enables flash discharge and reduces external component count. The device includes an
open-drain active-low DONE output to indicate when the photoflash voltage has reached regulation. The device automatically refreshes the output
voltage every 16s, thus efficiently maintains the capacitor charge level with minimum battery drain. The MAX8685A/MAX8685F feature an
undervoltage input (UVI) monitor. UVI monitors the supply voltage and suspends switching if the input voltage drops below a programmed threshold.
The MAX8685A/MAX8685F also feature a voltage-monitor output that provides a scaled replica of the output voltage. The voltage-monitor output is
used for interfacing with a microprocessor's internal A/D converter to assist in implementing red-eye reduction. The MAX8685C/MAX8685D, with fixed
peak-primary current limits of 1A and 1.6A, respectively, are offered in a 2mm x 3mm, 8-pin TDFN package. The MAX8685A/MAX8685F, with
resistor-programmable current limits of up to 2A (max) and 2.6A (max), respectively, are offered in a 3mm x 3mm, 14-pin TDFN package. All devices
operate over the -40°C to +85°C temperature range.
Maxim Integrated Products. All rights reserved. Page 2/5
II. Manufacturing Information
A. Description/Function: Xenon Photoflash Charger with IGBT Driver and Voltage Monitor
B. Process: S4
C. Number of Device Transistors: 6702
D. Fabrication Location: California, Texas or Japan
E. Assembly Location: Thailand
F. Date of Initial Production: January 19, 2007
III. Packaging Information
A. Package Type: 14-pin TDFN 3x3
B. Lead Frame: Copper
C. Lead Finish: 100% matte Tin
D. Die Attach: Conductive Epoxy
E. Bondwire: Gold (1.3 mil dia.)
F. Mold Material: Epoxy with silica filler
G. Assembly Diagram: #05-9000-2637
H. Flammability Rating: Class UL94-V0
MAX8685AETD+
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja: 54°C/W
K. Single Layer Theta Jc: 8.3°C/W
L. Multi Layer Theta Ja: 41°C/W
M. Multi Layer Theta Jc: 8.3°C/W
IV. Die Information
A. Dimensions: 50 X 58 mils
B. Passivation: Si
3
N
4
/SiO
2
(Silicon nitride/ Silicon dioxide
C. Interconnect: Al/0.5%Cu
D. Backside Metallization: None
E. Minimum Metal Width: Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn)
F. Minimum Metal Spacing: Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn)
G. Bondpad Dimensions: 5 mil. Sq.
H. Isolation Dielectric: SiO
2
I. Die Separation Method: Wafer Saw
Maxim Integrated Products. All rights reserved. Page 3/5

MAX8685DETA+T

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Battery Management Xenon Photoflash Charger
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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