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NCP623DM-28R2G

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
NCP623
http://onsemi.com
13
OUTPUT CAPACITOR ESR
Figure 28. Output Stability versus Output
Current Over Temperature (1.0 mF, 3.0 V)
OUTPUT CURRENT (mA)
1.0
10
100
1000
0 10 20 30 40 50 60 70 80 90 100110 120130140150
UNSTABLE
STABLE
OUTPUT CAPACITOR ESR
Figure 29. Output Stability with Output
Capacitor Change
OUTPUT CURRENT (mA)
150 mF
1.0 mF
0.1 mF
0.01
0.1
1.0
10
100
0 10 20 30 40 50 60 70 80 90 100110120130140150
OUTPUT CAPACITOR ESR
Figure 30. Output Stability versus Output
Current Over Temperature (150 mF, 3.0 V)
OUTPUT CURRENT (mA)
−40°C
25°C
85°C
C
out
= 150 mF
V
out
= 3.0 V
UNSTABLE
STABLE
Figure 31. Ripple Rejection versus Frequency with
10 nF Bypass Capacitor
FREQUENCY (Hz)
V
in
= 3.8 V
V
out
= 2.8 V
C
O
= 1.0 mF
I
out
= 60 mA
T
amb
= 25°C
100
0
(dB)
1000 100,000
−10
−60
−70
−80
−100
−90
10,000
−20
−30
−40
−50
0.01
0.10
1.0
10
100
0 10 20 30 40 50 60 70 80 90 100110 120130140150
85°C
25°C
−40°C
C
out
= 1.0 mF
V
out
= 3.0 V
UNSTABLE
STABLE
Figure 32. Ripple Rejection versus Frequency
without Bypass Capacitor
FREQUENCY (Hz)
V
in
= 3.8 V
V
out
= 2.8 V
C
O
= 1.0 mF
I
out
= 60 mA
T
amb
= 25°C
10
0
(dB)
1000 100,000
−60
−80
−120
10,000
−20
−40
100 1,000,000
−100
0.01
0.10
1.0
10
100
0 10 20 30 40 50 60 70 80 90 100110120130140150
−40°C
25°C
85°C
C
out
= 0.0 mF
V
out
= 3.0 V
UNSTABLE
STABLE
25°C
85°C
−40°C
UNSTABLE
OUTPUT CAPACITOR ESR
Figure 33. Output Stability versus Output
Current Over Temperature (0.1 mF, 3.0 V)
OUTPUT CURRENT (mA)
NCP623
http://onsemi.com
14
ORDERING INFORMATION
Device Version Marking Package Shipping
†
NCP623DM−28R2G 2.8 V LJA Micro8
(Pb−Free)
4000 Tape & Reel
NCP623DM−30R2G 3.0 V LBJ Micro8
(Pb−Free)
NCP623DM−33R2G 3.3 V LFW Micro8
(Pb−Free)
NCP623DM−40R2 4.0 V LGN Micro8
NCP623DM−40R2G 4.0 V LGN Micro8
(Pb−Free)
NCP623DM−50R2G 5.0 V LFX Micro8
(Pb−Free)
NCP623MN−25R2G 2.5 V 25 DFN6, 3x3
(Pb−Free)
3000 Tape & Reel
NCP623MN−28R2G 2.8 V 28 DFN6, 3x3
(Pb−Free)
NCP623MN−30R2G 3.0 V 30 DFN6, 3x3
(Pb−Free)
NCP623MN−33R2 3.3 V 33 DFN6, 3x3
NCP623MN−33R2G 3.3 V 33 DFN6, 3x3
(Pb−Free)
NCP623MN−40R2 4.0 V 40 DFN6, 3x3
NCP623MN−40R2G 4.0 V 40 DFN6, 3x3
(Pb−Free)
NCP623MN−50R2G 5.0 V 50 DFN6, 3x3
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NCP623
http://onsemi.com
15
PACKAGE DIMENSIONS
Micro8t
CASE 846A−02
ISSUE H
S
B
M
0.08 (0.003) A
S
T
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
b
e
PIN 1 ID
8 PL
0.038 (0.0015)
−T−
SEATING
PLANE
A
A1
c
L
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
8X
8X
6X
ǒ
mm
inches
Ǔ
SCALE 8:1
1.04
0.041
0.38
0.015
5.28
0.208
4.24
0.167
3.20
0.126
0.65
0.0256
DIM
A
MIN NOM MAX MIN
MILLIMETERS
−− −− 1.10 −−
INCHES
A1 0.05 0.08 0.15 0.002
b 0.25 0.33 0.40 0.010
c 0.13 0.18 0.23 0.005
D 2.90 3.00 3.10 0.114
E 2.90 3.00 3.10 0.114
e 0.65 BSC
L 0.40 0.55 0.70 0.016
−− 0.043
0.003 0.006
0.013 0.016
0.007 0.009
0.118 0.122
0.118 0.122
0.026 BSC
0.021 0.028
NOM MAX
4.75 4.90 5.05 0.187 0.193 0.199
H
E
H
E
DD
E
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16

NCP623DM-28R2G

Mfr. #:
Buy NCP623DM-28R2G
Manufacturer:
ON Semiconductor
Description:
IC REG LINEAR 2.8V 150MA MICRO8
Lifecycle:
New from this manufacturer.
Delivery:
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