8281
AND
8282
LNB SUPPLY AND
CONTROL-VOLTAGE REGULATORS
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
4
ELECTRICAL CHARACTERISTICS: unless otherwise noted at T
J
125°C, C
LNB
= 0.1-µF,
4.5
-V + V
LNB
V
IN
47-V.
Limits
Characteristic Symbol Test Conditions Min. Typ. Max. Units
Protection Circuitry
Current-Limiting Threshold V
ILNB(th)
V
BULK
– V
SENSE
115 135 155 mV
Overload Flag Output Low V
OLF
I
OLF
= 8-mA 0.28 0.5 V
Overload Flag Leakage Current I
OLF
V
OLF
= 5.5-V <1.0 10 µA
Thermal Shutdown Temp. T
J
165 °C
Thermal Shutdown Hysteresis T
J
—20—°C
NOTES: 1. Typical data is for design information only.
2. Negative current is defined as coming out of (sourcing) the specified device terminal.
8281
AND
8282
LNB SUPPLY AND
CONTROL-VOLTAGE REGULATORS
5
www.allegromicro.com
Buck regulator. A current-mode buck converter
provides the linear regulator a supply voltage that
tracks the selected LNB output voltage. The buck
converter operates at 16 times the internal tone fre-
quency, nominally 352-kHz.
The tracking regulator provides minimum power
dissipation across the range of output voltages by
adjusting the SENSE terminal voltage, nominally
900-mV above the LNB output voltage. The tracking
regulator also provides adequate headroom for tone
injection.
Linear regulator. The output linear regulator will
sink or source current. This allows tone modulation
into a capacitive load of 0.1-µF over the output
current range of 12-mA to 750-mA.
Slew rate control. The programmed output volt-
age rise and fall times can be set by an external
capacitor (with an internal 25-k resistor) located on
the TCAP terminal. The range of acceptable capaci-
tor values is 4.7-nF to 47-nF. This feature only
affects the turn-on and programmed voltage rise and
fall times. Modulation is unaffected by the capacitor.
If LNB output voltage rise and fall time limiting is
not required, the TCAP terminal should use a 100-nF
ceramic as a default value to minimize output noise.
If a small value capacitor is used, the rise time will be
limited by the time required to charge the VBULK
capacitor.
Short-circuit limit regulator. The LNB output is
current limited. The short-circuit protection threshold
is set by the value of an external resistor, R
S
, in
conjunction with an internal 135-mV reference
voltage (V
ILNB(th)
).
R
S
= 0.135/I
LNBM
where I
LNBM
is the desired current-limit value. The
sense resistor should be chosen based on the maxi-
mum dc plus ac (tone) load current required, internal
V
ILNB(th)
tolerance, and sense resistor accuracy. For
750-mA applications, a precision 140-m resistor is
recommended. For 500-mA applications, the resistor
value can be raised to 200-m.
In operation, the short-circuit protection produces
current limiting at the input due to the tracking con-
verter. If the output is shorted, the linear regulator
will limit the output current to I
LNBM
.
Fault output. Short-circuit or thermal shutdown
will cause the OLF terminal, an open-drain diagnostic
output flag, to go LOW.
Internal tone modulation. The ENT (tone enable)
terminal activates the internal tone signal, modulating
the dc output with a 650-mV peak-to-peak trapezoidal
waveform. The internal oscillator is factory trimmed
to provide a tone of 22-kHz. No further adjustment is
required. Burst coding of the tone can be accom-
plished, due to the fast response of the ENT input and
rapid tone response. This allows implementation of
the DiSEqC™ protocols.
External tone modulation. To improve design
flexibility and to allow implementation of proposed
LNB remote control standards, an analog modulation
input terminal is available (EXTM). An appropriate
dc-blocking capacitor must be used to couple the
modulating signal source to the EXTM terminal. The
peak-to-peak input amplitude should stay within
100-mV to 125-mV to ensure the DiSEqC amplitude
specification over the output current range. If exter-
nal modulation is not used, the EXTM terminal
should be decoupled to ground with a 0.1-µF ceramic
capacitor.
FUNCTIONAL DESCRIPTION
8281
AND
8282
LNB SUPPLY AND
CONTROL-VOLTAGE REGULATORS
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
6
APPLICATIONS INFORMATION
Component selection:
Input capacitor, C
IN
. An electrolytic capacitor
should be located as close to the device VIN terminal
as possible. The input current is a square wave with
fast rise and fall times so the capacitor must be able to
handle the rms current without excessive temperature
rise. The value of this capacitor is not as important as
the ESR. The worst-case current is with maximum
load current, minimum V
IN
, and maximum V
LNB
(highest switch duty cycle). Choose a capacitor with
a ripple current rating greater than
I
cin
= I
LNB
x 1.2 x V
LNB(max)
/V
IN(min)
Buck inductor, L1. A 100-µH power inductor is
appropriate for all operating conditions. The rated
saturation current of the inductor must be greater than
1.3-A. To maximize efficiency, the dc resistance
should be less than 350-m.
Clamp diode, D1. A Schottky diode is required at
the switching node LX. This diode should be rated at
1.5 times the maximum load current.
Output capacitor, C
BULK
. A low-ESR (<200-m)
electrolytic capacitor is recommended to minimize
the ripple voltage. Less than 50-mV peak-to-peak is a
reasonable goal.
V
ripple(PP)
= ESR x I
ripple(max)
where
I
ripple(max)
= V
BULK(min)
x (1 – [V
BULK(min)
/V
IN(max)
]) /
(L1 x 352
-
kHz).
Output capacitor, C
LNB
. Increasing the output
capacitance, C
LNB
, will attenuate noise. However,
this is limited by the requirement for low cable
capacitance for 22-kHz tone transmission.
Also, because the linear regulator sink current is
limited, high values of output capacitance combined
with low levels of output current can cause overshoot
of the 22-kHz tone. Operating points above the line
in the following graph will not have excessive over-
shoot.
0.5
Dwg. GP-074
1.0 1.5
OUTPUT CAPACITANCE IN µF
0
100
OUTPUT CURRENT IN mA
50
0
25
75
125
MINIMAL OVERSHOOT
EXCESSIVE OVERSHOOT
Layout notes:
1. The printed wiring board should use a heavy
ground plane. A two-sided board with ground planes
on both sides of the board is most desirable. Several
copper vias under the device can be used to connect
the ground planes and enhance thermal performance.
2. For optimum electrical and thermal performance,
the device should be soldered directly onto the board.
3. Keep the sense resistor traces as short and as wide
as possible to lower trace resistance.
4. Connect the bypass capacitors as close to the
device as possible. The lower value ceramic capaci-
tors should be closer to the device than the
electrolytics. The supply voltage, V
IN
, should be
decoupled with an electrolytic capacitor placed as
close to the device as possible.
5. Place the TCAP capacitor as close to the device as
possible.

A8282SLBTR-T

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IC REG CONV RECVRS 1OUT 24SOIC
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